EP2AGX65DF29I3NAA

The EP2AGX65DF29I3NAA is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball BGA (FCBGA) package. It delivers a combination of programmable logic, embedded memory, and a high I/O count for designs that need on-chip integration under industrial operating conditions.

Key attributes include a large logic capacity, multiple megabits of on-chip RAM, an extensive I/O complement, and support for surface-mount assembly in a compact 29×29 package footprint.

Key Features

• Logic Capacity  Approximately 60,214 logic elements and 2,530 logic array blocks (LABs) provide substantial programmable resources for complex control, datapath, and glue-logic implementations.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM to store buffers, LUT-based memory, and state data without external memory.
• I/O Resources  364 user I/O pins enable broad peripheral interfacing and system-level connectivity.
• Power and Voltage  Core supply specified between 870 mV and 930 mV for the device core voltage domain.
• Package & Mounting  780-ball BGA (FCBGA) package, supplier package 780-FBGA (29×29), designed for surface-mount assembly to support compact, high-density PCB layouts.
• Operating Range  Industrial temperature grade with an operating range from −40 °C to 100 °C for deployments in demanding environments.
• Regulatory Compliance  RoHS compliant.

Unique Advantages

• High logic density: Large count of logic elements helps implement complex finite-state machines, custom accelerators, and glue logic without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 5.37 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage, simplifying board design.
• Extensive I/O complement: 364 I/Os enable flexible interfacing to sensors, peripherals, and board-level busses, reducing the need for additional I/O expanders.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support systems intended for industrial and harsh-environment applications.
• Compact, high-pin-count package: 780-ball FCBGA (29×29) provides a high I/O density in a space-efficient footprint for compact system designs.
• Low-voltage core operation: Core supply range of 870 mV–930 mV supports designs targeting low-voltage FPGA operation.

Why Choose EP2AGX65DF29I3NAA?

EP2AGX65DF29I3NAA positions itself as a versatile Arria II GX FPGA option for engineers who require a high logic count, multi-megabit embedded memory, and a large I/O complement in an industrial-temperature, surface-mount BGA package. Its balance of on-chip resources and package density supports consolidated designs where board space and integration are priorities.

The device is suited to development teams and integrators looking for a field-programmable solution from Intel that combines significant logic and memory capacity with industrial operating range and RoHS compliance.

Request a quote today to discuss availability and pricing for EP2AGX65DF29I3NAA and to obtain additional procurement details.