EP2AGX65DF29C6N

The EP2AGX65DF29C6N is an Arria II GX field-programmable gate array (FPGA) in a 780-BBGA (FCBGA) package. It provides a balanced combination of programmable logic, embedded RAM, and a high I/O count for commercial designs.

With 60,214 logic elements and approximately 5.37 Mbits of embedded memory, this device is intended for commercial-grade applications that require moderate-to-high logic density, substantial on-chip memory, and extensive I/O connectivity within a surface-mount 29×29 FBGA footprint.

Key Features

• Logic Capacity — 60,214 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded Memory — Total RAM bits: 5,371,904, providing approximately 5.37 Mbits of on-chip memory for buffering, FIFOs, and local data storage.
• I/O Resources — 364 I/O pins to support dense external interfacing and multi-bus connectivity.
• Power Supply — Core supply range 870 mV to 930 mV, enabling designs that target the device’s specified core-voltage window.
• Package & Mounting — 780-BBGA (supplier package: 780-FBGA, 29×29) in a surface-mount form factor for board-level integration where compact BGA packaging is required.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial-environment deployments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

• Commercial Embedded Systems — Implement control logic and custom peripherals where up to 60,214 logic elements and substantial on-chip RAM simplify system architecture.
• Multi-I/O Interface Designs — Leverage 364 I/O pins for designs that require multiple parallel interfaces or dense signal routing to external devices.
• Prototyping and Hardware Acceleration — Use the device’s logic and memory resources to prototype custom hardware blocks or accelerate compute tasks within a commercial temperature range.

Unique Advantages

• Substantial Logic Integration: 60,214 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant On-Chip Memory: Approximately 5.37 Mbits of embedded memory supports local buffering and efficient data handling without relying solely on external memory.
• High Pin Count: 364 I/Os provide flexible connectivity for complex systems and multi-interface requirements.
• Compact BGA Packaging: 780-BBGA (29×29) surface-mount package delivers a high-density solution suitable for space-constrained PCBs.
• Commercial Temperature Rating: Designed to operate across a 0 °C to 85 °C range, matching common commercial deployment environments.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose EP2AGX65DF29C6N?

The EP2AGX65DF29C6N positions itself as a capable commercial-grade Arria II GX FPGA that balances logic density, embedded memory, and extensive I/O in a compact 780-BBGA package. It is suited for designers who need significant on-chip resources and a high pin count while maintaining a surface-mount form factor and standard commercial temperature operation.

This device is appropriate for teams focused on reducing board-level complexity through integration, prototyping advanced logic functions, or implementing multi-interface commercial systems where verified FPGA resources and RoHS compliance are required.

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