EP2AGX65DF29C6

The EP2AGX65DF29C6 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package and designed for commercial-grade applications. It provides a balance of logic density, embedded memory, and I/O capability suitable for mid-range FPGA implementations that require surface-mount packaging and a compact 29×29 ball footprint.

As a member of the Arria II GX family, this device benefits from the series’ documented electrical and switching characteristics, and is intended for designs that require substantial on-chip logic and memory resources within a commercial operating range.

Key Features

• Core Logic — 60,214 logic elements delivering substantial programmable logic capacity for complex combinational and sequential designs.
• Logic Array Blocks — 2,530 logic array blocks (LABs) to organize and optimize logic placement and routing.
• Embedded Memory — Approximately 5.37 Mbits of total on-chip RAM for buffering, FIFOs, and distributed storage.
• I/O Capacity — 364 user I/O pins to support multiple interfaces and board-level connectivity.
• Package & Mounting — 780-ball FCBGA (29×29) package, surface-mount mounting type, enabling high-density board integration.
• Power — Core supply range specified from 870 mV to 930 mV to match required FPGA core voltage rails.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• Regulatory — RoHS compliant for adherence to current lead-free and restricted substances requirements.

Typical Applications

• Mid-range FPGA designs — With over 60k logic elements and several megabits of embedded RAM, the device supports complex logic integration and moderate memory requirements common to mid-range programmable designs.
• High-density I/O subsystems — 364 user I/Os provide flexibility for multi-channel interface routing, expansion headers, and board-level connectivity in communications and instrumentation products.
• Compact, board-level integration — The 780-ball FCBGA (29×29) surface-mount package enables a compact footprint for space-constrained systems where high logic density is required.

Unique Advantages

• Substantial programmable logic: 60,214 logic elements allow integration of complex state machines, custom datapaths, and control logic without external ASICs.
• Significant embedded memory: Approximately 5.37 Mbits of on-chip RAM reduces dependence on external memory for buffering and intermediate data storage.
• High I/O count: 364 I/Os enable broad interfacing options and routing flexibility for multi-protocol designs.
• Industry-standard package: 780-FBGA (29×29) package provides a known assembly footprint for high-density PCB designs.
• Commercial temperature rating: 0 °C to 85 °C supports a wide range of commercial applications and environments.
• Regulatory compliance: RoHS compliance simplifies design for markets requiring restricted-substance adherence.

Why Choose EP2AGX65DF29C6?

The EP2AGX65DF29C6 positions itself as a commercially rated Arria II GX FPGA that combines a large logic element count with multiple megabits of embedded RAM and a high I/O complement in a 780-ball FCBGA package. Its core voltage range and commercial temperature spec make it suitable for mainstream embedded and board-level applications that demand compact packaging and considerable programmable resources.

This device is an appropriate choice for engineering teams seeking to consolidate logic, memory, and I/O on a single programmable device while maintaining compliance with RoHS requirements and using a standardized package for high-density PCB assembly.

Request a quote or submit an inquiry to get pricing and availability for EP2AGX65DF29C6 and to discuss how it fits your next FPGA design.