EP2AGX65DF29C4N

The EP2AGX65DF29C4N is an Arria II GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 780-FBGA (29×29) surface-mount package. It delivers programmable logic capacity, embedded memory, and a high count of I/O for board-level designs that require flexible, reconfigurable logic.

This commercial-grade device provides 60,214 logic elements, approximately 5.37 Mbits of embedded memory, 364 I/O pins, and a core supply operating range of 870 mV to 930 mV. It is specified for operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Logic Capacity  About 60,214 logic elements to implement custom digital logic, state machines, and programmable datapaths.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for FIFOs, buffers, and embedded storage.
• I/O Density  364 available I/O pins for high-density interfacing to peripherals, memory, and external devices.
• Package and Mounting  780-FBGA (29×29) FCBGA package, surface-mount for board-level integration.
• Power  Core supply voltage specified between 870 mV and 930 mV to match system power design requirements.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Implement complex, reconfigurable logic functions using the device’s 60,214 logic elements and embedded memory.
• High-density I/O interfaces  Use the 364 I/O pins for multi-channel sensor interfaces, parallel data paths, or glue logic between system components.
• Memory-intensive functions  Leverage approximately 5.37 Mbits of embedded RAM for buffering, packet processing, and temporary data storage on-chip.

Unique Advantages

• Substantial logic resources:  60,214 logic elements enable large-scale custom logic implementations without external glue logic.
• Embedded memory for system integration:  Approximately 5.37 Mbits of RAM reduces the need for external memory in many buffering and storage use cases.
• High I/O count:  364 I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing board complexity.
• Compact package:  780-FBGA (29×29) package supports surface-mount assembly for compact, production-ready boards.
• Commercial temperature rating:  Specified operation from 0 °C to 85 °C for standard commercial applications.
• RoHS compliant:  Designed to meet RoHS requirements for environmental and regulatory conformity.

Why Choose EP2AGX65DF29C4N?

The EP2AGX65DF29C4N positions itself as a commercial-grade Arria II GX FPGA offering a balanced combination of logic resources, embedded memory, and high I/O density in a compact 780-FBGA package. Its electrical and switching characteristics are documented by the Arria II device handbook and related datasheet material for designers who need verifiable device-level specifications.

This device is suited to engineering teams building board-level systems that require sizable on-chip logic and memory capacity, multiple I/O channels, and a commercial operating temperature range. The combination of these measured specifications supports scalable designs where on-chip resources reduce external component count and simplify system architecture.

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