EP2AGX65DF29C4

The EP2AGX65DF29C4 is an Arria II GX-series field programmable gate array (FPGA) manufactured by Intel. It delivers a balance of on-chip logic, embedded memory, and I/O capacity in a 780-ball FCBGA package targeted at commercial-grade applications.

This device is suitable for designs that require significant programmable logic (60,214 logic elements), substantial embedded RAM (approximately 5.37 Mbits), and up to 364 I/O pins, while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Programmable Logic  Approximately 60,214 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for buffers, FIFOs, and state storage directly within the FPGA fabric.
• I/O Capacity  364 I/O pins to accommodate multiple parallel interfaces, sensors, and peripheral connections.
• Power Supply  Core voltage supply specified between 870 mV and 930 mV for power domain planning and board design.
• Package & Mounting  780-ball BGA (FCBGA, supplier package: 780-FBGA 29×29) in a surface-mount format for compact board integration.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant, supporting lead-free and restricted-substance requirements.

Typical Applications

• Telecommunications & Networking  Use the programmable logic and embedded memory for packet processing, protocol bridging, and custom datapath acceleration.
• High-density I/O Control  Leverage 364 I/Os for multi-channel data acquisition, interface aggregation, and sensor hub implementations.
• Embedded Processing & Acceleration  Deploy on-chip logic and RAM to offload deterministic tasks, implement custom accelerators, or handle control-plane functions.
• Prototyping and System Integration  Surface-mount FCBGA package and commercial-grade thermal range make the device suitable for proof-of-concept and production commercial electronics.

Unique Advantages

• Substantial Logic Density:  Approximately 60k logic elements enable complex finite-state machines, parallel datapaths, and sizable custom logic blocks without external ASICs.
• Embedded Memory On-Chip:  Approximately 5.37 Mbits of RAM reduces reliance on external memory for buffering and small working sets, simplifying BOM and PCB layout.
• High I/O Count:  364 I/Os support rich peripheral connectivity and multi-channel interfaces directly at the FPGA boundary.
• Compact, Surface-Mount Package:  780-ball FCBGA (29×29) enables high-density board designs while maintaining a standard surface-mount assembly flow.
• Commercial Temperature Range:  Rated for 0 °C to 85 °C, appropriate for a wide range of commercial electronic products and systems.
• RoHS Compliance:  Meets environmental and manufacturing requirements for lead-free production.

Why Choose EP2AGX65DF29C4?

The EP2AGX65DF29C4 Arria II GX FPGA from Intel combines a sizable logic fabric, embedded memory, and a high I/O count in a 780-ball FCBGA surface-mount package, making it well suited for commercial applications that require programmable acceleration, interface consolidation, and application-specific logic. Its specified core voltage range and commercial operating temperature band provide the concrete electrical and environmental boundaries needed for reliable system design.

This part is appropriate for engineering teams developing networking equipment, embedded controllers, and high-density I/O systems who need a commercially graded FPGA with on-chip memory and significant logic capacity while maintaining RoHS compliance.

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