EP2AGX65DF25I5G

IC FPGA 252 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 252 5371904 60214 572-BGA, FCBGA

Quantity 476 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case572-BGA, FCBGANumber of I/O252Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells60214
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits5371904

Overview of EP2AGX65DF25I5G – Arria II GX FPGA, 572-FBGA, Industrial

The EP2AGX65DF25I5G is an Arria II GX field-programmable gate array (FPGA) in a 572-FBGA surface-mount package, offered for industrial-grade applications. It is part of the Arria II device family, featuring a 40-nm, low-power FPGA engine and architecture intended for high-bandwidth system interfaces and integrated signal processing.

This device targets designs that require a balance of programmable logic, embedded memory and high-speed serial interfaces — including communications, networking, memory interfaces and DSP-focused systems — while supporting industrial operating conditions.

Key Features

  • Core Architecture  40-nm Arria II GX FPGA architecture designed for low-power, programmable logic operation and streamlined integration.
  • Logic Capacity  Approximately 60,214 logic elements for implementing complex custom logic and control functions.
  • Embedded Memory  Approximately 5.37 Mbits of on-chip RAM to support FIFOs, buffers and on-chip data storage.
  • DSP and Multiplier Resources  Integrated DSP blocks and configurable multipliers for efficient implementation of signal-processing functions (per Arria II family specifications).
  • High-speed Transceivers and Protocol Support  Family-level support for up to 24 full-duplex transceivers with data rates up to 6.375 Gbps and dedicated circuitry for common serial protocols such as PCIe, Ethernet and various SDI and storage interfaces.
  • I/O and Packaging  252 user I/O pins in a 572-ball FCBGA (25 × 25) package, surface-mount mounting for compact board designs.
  • Power Supply  Operating core supply specified from 870 mV to 930 mV.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Security and Configuration  Arria II family features include configuration options and on-chip support for design security and protocol PHY/MAC integrations (see device handbook for details).
  • Environmental Compliance  RoHS-compliant.

Typical Applications

  • High-speed Communications  Implement PHY and MAC layers, protocol bridging and serial interfaces using the device's transceivers and dedicated physical-layer circuitry.
  • Network and Telecom Systems  Deploy for packet processing, timing and protocol conversion where multi-gigabit transceivers and deterministic logic are required.
  • Signal Processing and DSP  Use embedded DSP blocks and configurable multipliers for digital filtering, modulation/demodulation and other real-time processing tasks.
  • Memory Interface and Storage  Implement DDR3 interfaces and on-board buffering leveraging on-chip RAM and high I/O counts for storage controller or accelerator designs.
  • Broadcast and Video Transport  Support SD/HD/3G SDI and related serial media interfaces using the family’s SERDES and PHY support.

Unique Advantages

  • Integrated High-speed I/O:  Up to 24 full-duplex transceivers and dedicated physical-layer circuitry simplify implementation of multi-gigabit links.
  • Substantial Logic and Memory On-chip:  Roughly 60k logic elements and ~5.37 Mbits of embedded RAM reduce external component count for many designs.
  • Industrial Temperature Qualification:  Specified operation from −40 °C to 100 °C enables deployment in demanding industrial environments.
  • Compact, Surface-Mount Package:  572-FBGA (25 × 25) packaging enables high-density board designs while providing extensive I/O.
  • Established Development Flow:  Arria II family support and documentation provide integration paths for popular interfaces and IP (refer to the device handbook for tool and IP details).
  • Regulatory Compliance:  RoHS compliance helps meet environmental requirements for many customers and projects.

Why Choose EP2AGX65DF25I5G?

The EP2AGX65DF25I5G combines the Arria II GX family’s low-power 40-nm FPGA architecture with substantial logic capacity, embedded RAM and high-speed serial interfaces in a 572-FBGA industrial package. It is suited for designs that require integrated DSP capability, multi-gigabit links and reliable operation across industrial temperature ranges.

For engineering teams focused on communications, networking, real-time signal processing or memory-interface solutions, this device provides a balanced mix of programmable logic, on-chip memory and transceiver resources, backed by the Arria II device documentation and IP integration guidance.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX65DF25I5G.

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