EP2AGX65DF25I5G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 252 5371904 60214 572-BGA, FCBGA |
|---|---|
| Quantity | 476 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 252 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2530 | Number of Logic Elements/Cells | 60214 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5371904 |
Overview of EP2AGX65DF25I5G – Arria II GX FPGA, 572-FBGA, Industrial
The EP2AGX65DF25I5G is an Arria II GX field-programmable gate array (FPGA) in a 572-FBGA surface-mount package, offered for industrial-grade applications. It is part of the Arria II device family, featuring a 40-nm, low-power FPGA engine and architecture intended for high-bandwidth system interfaces and integrated signal processing.
This device targets designs that require a balance of programmable logic, embedded memory and high-speed serial interfaces — including communications, networking, memory interfaces and DSP-focused systems — while supporting industrial operating conditions.
Key Features
- Core Architecture 40-nm Arria II GX FPGA architecture designed for low-power, programmable logic operation and streamlined integration.
- Logic Capacity Approximately 60,214 logic elements for implementing complex custom logic and control functions.
- Embedded Memory Approximately 5.37 Mbits of on-chip RAM to support FIFOs, buffers and on-chip data storage.
- DSP and Multiplier Resources Integrated DSP blocks and configurable multipliers for efficient implementation of signal-processing functions (per Arria II family specifications).
- High-speed Transceivers and Protocol Support Family-level support for up to 24 full-duplex transceivers with data rates up to 6.375 Gbps and dedicated circuitry for common serial protocols such as PCIe, Ethernet and various SDI and storage interfaces.
- I/O and Packaging 252 user I/O pins in a 572-ball FCBGA (25 × 25) package, surface-mount mounting for compact board designs.
- Power Supply Operating core supply specified from 870 mV to 930 mV.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Security and Configuration Arria II family features include configuration options and on-chip support for design security and protocol PHY/MAC integrations (see device handbook for details).
- Environmental Compliance RoHS-compliant.
Typical Applications
- High-speed Communications Implement PHY and MAC layers, protocol bridging and serial interfaces using the device's transceivers and dedicated physical-layer circuitry.
- Network and Telecom Systems Deploy for packet processing, timing and protocol conversion where multi-gigabit transceivers and deterministic logic are required.
- Signal Processing and DSP Use embedded DSP blocks and configurable multipliers for digital filtering, modulation/demodulation and other real-time processing tasks.
- Memory Interface and Storage Implement DDR3 interfaces and on-board buffering leveraging on-chip RAM and high I/O counts for storage controller or accelerator designs.
- Broadcast and Video Transport Support SD/HD/3G SDI and related serial media interfaces using the family’s SERDES and PHY support.
Unique Advantages
- Integrated High-speed I/O: Up to 24 full-duplex transceivers and dedicated physical-layer circuitry simplify implementation of multi-gigabit links.
- Substantial Logic and Memory On-chip: Roughly 60k logic elements and ~5.37 Mbits of embedded RAM reduce external component count for many designs.
- Industrial Temperature Qualification: Specified operation from −40 °C to 100 °C enables deployment in demanding industrial environments.
- Compact, Surface-Mount Package: 572-FBGA (25 × 25) packaging enables high-density board designs while providing extensive I/O.
- Established Development Flow: Arria II family support and documentation provide integration paths for popular interfaces and IP (refer to the device handbook for tool and IP details).
- Regulatory Compliance: RoHS compliance helps meet environmental requirements for many customers and projects.
Why Choose EP2AGX65DF25I5G?
The EP2AGX65DF25I5G combines the Arria II GX family’s low-power 40-nm FPGA architecture with substantial logic capacity, embedded RAM and high-speed serial interfaces in a 572-FBGA industrial package. It is suited for designs that require integrated DSP capability, multi-gigabit links and reliable operation across industrial temperature ranges.
For engineering teams focused on communications, networking, real-time signal processing or memory-interface solutions, this device provides a balanced mix of programmable logic, on-chip memory and transceiver resources, backed by the Arria II device documentation and IP integration guidance.
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