EP2AGX65DF25I3G

The EP2AGX65DF25I3G is an industrial-grade Arria II GX field programmable gate array (FPGA) in a 572-ball FCBGA package. It delivers a high-density programmable fabric with approximately 60,214 logic elements and about 5.37 Mbits of embedded memory, enabling complex custom logic and buffering on a single device.

Designed for robust embedded and industrial applications, this device combines a large I/O count (252 I/O pins), a compact 25 × 25 mm 572-FBGA footprint, and a low-voltage core supply range (0.870–0.930 V) with an extended operating temperature range from −40 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 60,214 logic elements to implement complex custom logic, state machines, and hardware accelerators.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to logic.
• I/O Density  252 programmable I/O pins suitable for multi-channel interfacing, parallel buses, and mixed-signal front ends.
• Package and Mounting  572-ball FCBGA (25 × 25 mm) surface-mount package for high-density board-level integration.
• Power  Core supply operating range from 0.870 V to 0.930 V to match board power architectures that support low-voltage FPGA cores.
• Industrial Grade & Temperature Range  Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for elevated-reliability deployments.
• RoHS Compliant  Meets RoHS standards for restricted substances, facilitating regulatory compliance in many regions.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and abundant I/O make the device well suited for motor control, PLC interfaces, and factory automation logic.
• High‑Density Embedded Systems  Large logic capacity and on-chip memory support custom data-paths, protocol handling, and hardware acceleration in compact embedded platforms.
• Communications and Networking  The combination of logic elements, embedded RAM, and high I/O count enables packet processing, interface bridging, and custom protocol implementations.
• Prototyping and Custom Hardware  Surface-mount FCBGA package and industry-grade ratings allow clean transition from prototype boards to production hardware targeting industrial environments.

Unique Advantages

• High Logic Density: Approximately 60k logic elements provide plentiful resources for large custom designs without external ASICs.
• Substantial On‑Chip Memory: Around 5.37 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Flexible I/O Count: 252 I/O pins enable extensive peripheral connectivity and multiple parallel interfaces on a single device.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial grade marking support deployment in demanding environments.
• Compact, Production‑Ready Package: 572-FBGA (25 × 25 mm) surface-mount package balances board real estate with high pin count for production systems.
• Regulatory Compliance: RoHS compliance simplifies environmental qualification and global product acceptance.

Why Choose EP2AGX65DF25I3G?

The EP2AGX65DF25I3G combines high logic density, significant embedded memory, and a large I/O complement in a production-ready FCBGA package targeted to industrial applications. Its low-voltage core and extended temperature range make it suitable for robust, long-lived embedded systems where integration and reliability matter.

This FPGA is a practical choice for design teams needing scalable programmable logic, ample on-chip storage, and flexible interfacing in industrial and communications-focused designs. Its specifications support compact board layouts while delivering the resources required for complex custom hardware implementations.

Request a quote or submit a procurement inquiry to begin evaluating the EP2AGX65DF25I3G for your next design project.