EP2AGX65DF25C6N

The EP2AGX65DF25C6N is an Arria II GX family FPGA in a 572-ball FCBGA package optimized for commercial applications. It combines a high count of logic elements with multi-megabit on-chip memory and a broad I/O complement to support complex digital designs and system integration.

This device is intended for designers who require dense programmable logic, embedded memory, and a compact surface-mount package while operating within standard commercial temperature and voltage ranges.

Key Features

• Logic Capacity  Provides 60,214 logic elements suitable for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM to support buffering, state storage, and embedded-data structures.
• I/O Resources  252 user I/O pins to interface with peripherals, serializers, and board-level connectivity.
• Power and Voltage  Core supply range specified at 0.870 V to 0.930 V for core power planning and regulator selection.
• Package and Mounting  Surface-mount FCBGA in a 572-ball, 25×25 package footprint for high-density board integration.
• Operating Range  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Regulatory  RoHS-compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• High-density logic and prototyping  Leverage 60,214 logic elements and approximately 5.37 Mbits of embedded memory for complex logic implementations and proof-of-concept designs.
• System I/O aggregation  252 I/O pins enable consolidation of multiple peripheral interfaces and board-level signal routing.
• Compact system integration  The 572-ball FCBGA (25×25) surface-mount package supports space-constrained PCBs and dense module designs.

Unique Advantages

• High on-chip integration: Combines a large logic element count with multi-megabit embedded RAM to reduce external component needs and simplify board design.
• Flexible I/O capacity: 252 I/Os provide headroom for interfacing multiple peripherals, memory buses, or custom interfaces without immediate external multiplexing.
• Compact packaging: 572-FBGA (25×25) package enables dense placement and reliable surface-mount assembly for modern PCB layouts.
• Low-voltage core: Core supply window of 0.870–0.930 V supports efficient power architectures and precise regulator selection.
• Commercial temperature rating: Rated 0 °C to 85 °C for mainstream electronic applications where this thermal range is required.
• RoHS compliant: Meets common lead-free manufacturing requirements for easier integration into modern production processes.

Why Choose EP2AGX65DF25C6N?

The EP2AGX65DF25C6N offers a balanced mix of logic density, embedded memory, and I/O capacity in a compact FCBGA package, making it well suited for commercial designs that require substantial programmable logic and on-chip memory while maintaining a small board footprint. Its defined core-voltage range and commercial operating temperature simplify system power and thermal planning.

This FPGA is a practical choice for engineering teams developing medium- to high-complexity digital systems that benefit from integrated memory and a high count of user I/Os, backed by the Arria II GX device family specifications.

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