EP2AGX65DF25C5N
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 252 5371904 60214 572-BGA, FCBGA |
|---|---|
| Quantity | 862 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 252 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2530 | Number of Logic Elements/Cells | 60214 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5371904 |
Overview of EP2AGX65DF25C5N – Arria II GX FPGA, 60,214 logic elements, ~5.37 Mbits RAM, 252 I/Os, 572-FBGA
The EP2AGX65DF25C5N is a commercial‑grade Arria II GX field‑programmable gate array (FPGA) from Intel. It provides a high‑density programmable fabric with 60,214 logic elements and approximately 5.37 Mbits of embedded memory to implement complex digital functions and system integration in a single device.
Packaged in a compact 572‑FBGA (25×25) surface‑mount package with 252 user I/Os and RoHS compliance, this device targets designs that require substantial on‑chip logic, embedded RAM, and a defined commercial operating range.
Key Features
- Logic Capacity — 60,214 logic elements for implementing sizable combinational and sequential logic designs.
- Embedded Memory — Approximately 5.37 Mbits of on‑chip RAM to support data buffering, state storage, and memory‑intensive functions.
- I/O Density — 252 available I/Os to connect peripherals, interfaces, and board‑level signals.
- Package & Mounting — 572‑FBGA (FCBGA) in a 25×25 footprint; surface‑mount mounting for compact board integration.
- Power Supply — Core voltage supply range specified at 870 mV to 930 mV to match system power design.
- Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory Compliance — RoHS compliant, supporting lead‑free assembly requirements.
Unique Advantages
- High integration density: 60,214 logic elements and substantial on‑chip RAM reduce the need for external components and simplify board layout.
- Robust I/O count: 252 user I/Os provide flexibility for connecting multiple interfaces and peripherals without multiplexing compromises.
- Compact surface‑mount package: The 572‑FBGA (25×25) package enables high‑density PCB designs while maintaining thermal and signal routing advantages of a BGA.
- Defined commercial operating range: Rated for 0 °C to 85 °C, making the device suitable for standard commercial environments and deployments.
- Controlled core power requirements: Core supply specified between 870 mV and 930 mV for predictable power budgeting and regulation design.
- RoHS compliance: Facilitates use in lead‑free manufacturing processes and helps meet environmental regulations.
Why Choose EP2AGX65DF25C5N?
The EP2AGX65DF25C5N delivers a balanced combination of high logic density, substantial embedded memory, and flexible I/O in a compact 572‑FBGA package. Its commercial‑grade rating and defined electrical requirements simplify integration into mid‑to‑high complexity digital systems where on‑chip resources and board‑level I/O availability matter.
This device is well suited to designers and procurement teams seeking a proven Arria II GX family FPGA with verifiable specifications for logic capacity, memory, I/O count, power supply range, and operating temperature — providing a reliable building block for scalable system designs.
Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX65DF25C5N, and consult the product datasheet for full electrical and timing specifications.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018