EP2AGX65DF25C5N

IC FPGA 252 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 252 5371904 60214 572-BGA, FCBGA

Quantity 862 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeCommercialOperating Temperature0°C – 85°C
Package / Case572-BGA, FCBGANumber of I/O252Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells60214
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5371904

Overview of EP2AGX65DF25C5N – Arria II GX FPGA, 60,214 logic elements, ~5.37 Mbits RAM, 252 I/Os, 572-FBGA

The EP2AGX65DF25C5N is a commercial‑grade Arria II GX field‑programmable gate array (FPGA) from Intel. It provides a high‑density programmable fabric with 60,214 logic elements and approximately 5.37 Mbits of embedded memory to implement complex digital functions and system integration in a single device.

Packaged in a compact 572‑FBGA (25×25) surface‑mount package with 252 user I/Os and RoHS compliance, this device targets designs that require substantial on‑chip logic, embedded RAM, and a defined commercial operating range.

Key Features

  • Logic Capacity — 60,214 logic elements for implementing sizable combinational and sequential logic designs.
  • Embedded Memory — Approximately 5.37 Mbits of on‑chip RAM to support data buffering, state storage, and memory‑intensive functions.
  • I/O Density — 252 available I/Os to connect peripherals, interfaces, and board‑level signals.
  • Package & Mounting — 572‑FBGA (FCBGA) in a 25×25 footprint; surface‑mount mounting for compact board integration.
  • Power Supply — Core voltage supply range specified at 870 mV to 930 mV to match system power design.
  • Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance — RoHS compliant, supporting lead‑free assembly requirements.

Unique Advantages

  • High integration density: 60,214 logic elements and substantial on‑chip RAM reduce the need for external components and simplify board layout.
  • Robust I/O count: 252 user I/Os provide flexibility for connecting multiple interfaces and peripherals without multiplexing compromises.
  • Compact surface‑mount package: The 572‑FBGA (25×25) package enables high‑density PCB designs while maintaining thermal and signal routing advantages of a BGA.
  • Defined commercial operating range: Rated for 0 °C to 85 °C, making the device suitable for standard commercial environments and deployments.
  • Controlled core power requirements: Core supply specified between 870 mV and 930 mV for predictable power budgeting and regulation design.
  • RoHS compliance: Facilitates use in lead‑free manufacturing processes and helps meet environmental regulations.

Why Choose EP2AGX65DF25C5N?

The EP2AGX65DF25C5N delivers a balanced combination of high logic density, substantial embedded memory, and flexible I/O in a compact 572‑FBGA package. Its commercial‑grade rating and defined electrical requirements simplify integration into mid‑to‑high complexity digital systems where on‑chip resources and board‑level I/O availability matter.

This device is well suited to designers and procurement teams seeking a proven Arria II GX family FPGA with verifiable specifications for logic capacity, memory, I/O count, power supply range, and operating temperature — providing a reliable building block for scalable system designs.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX65DF25C5N, and consult the product datasheet for full electrical and timing specifications.

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