EP2AGX65DF25C4G

IC FPGA 252 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 252 5371904 60214 572-BGA, FCBGA

Quantity 733 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeCommercialOperating Temperature0°C – 85°C
Package / Case572-BGA, FCBGANumber of I/O252Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells60214
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5371904

Overview of EP2AGX65DF25C4G – Arria II GX FPGA, 60,214 logic elements, ~5.37 Mbits RAM, 252 I/Os, 572-FBGA (25×25)

The EP2AGX65DF25C4G is an Intel Arria II GX field-programmable gate array (FPGA) in a 572-FBGA package designed for commercial applications. It pairs a 40-nm, low-power FPGA engine with a high logic density and substantial embedded memory to accelerate digital signal processing, high-speed serial interfaces, and system-level integration.

Targeted at designs that require integrated DSP resources, multi-gigabit transceivers and flexible I/O, this device addresses communications, networking, storage interface, and DSP-accelerated applications while operating within a commercial temperature range.

Key Features

  • FPGA Core  40-nm low-power FPGA engine with adaptive logic for efficient logic implementation.
  • Logic Capacity  60,214 logic elements to implement complex programmable logic and control functions.
  • Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
  • DSP Resources  High-performance DSP blocks (documented up to 550 MHz) for hardware acceleration of signal processing algorithms.
  • High-speed Transceivers & Protocol Support  Transceivers supporting data rates up to 6.375 Gbps with dedicated circuitry for common serial protocols including PCIe Gen1/Gen2, Ethernet, Serial RapidIO, CPRI, SDI, XAUI/RXAUI, SATA/SAS, GPON and others.
  • I/O  252 user I/Os in a modular bank architecture supporting a broad range of single-ended and differential standards.
  • Security & Configuration  On-chip options include AES programming file encryption and parallel/serial configuration modes for design security and flexible configuration.
  • Power & Supply  Operates from a core voltage supply range of 870 mV to 930 mV, enabling low-voltage system designs.
  • Package & Mounting  Surface-mount 572-FBGA package (supplier designation 572-FBGA, FC (25×25)) for compact board-level integration.
  • Operating Range & Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High-Speed Networking  Implements multi-gigabit interfaces and protocol PHY/MAC functions for switches, routers and network appliances using the device’s transceivers and protocol support.
  • Storage & Host Interfaces  Enables PCIe and SATA/SAS connectivity and bridging functions where programmable logic and on-chip memory are required.
  • Data Acquisition & DSP Acceleration  Uses on-chip DSP blocks and embedded RAM for real-time signal processing, filtering and data aggregation in test, measurement and instrumentation systems.
  • Broadcast & Video Transport  Supports SD/HD/3G SDI and related serial interfaces for video transport and processing applications.

Unique Advantages

  • High Logic Density: 60,214 logic elements provide capacity for complex control, protocol handling and custom logic without external ASICs.
  • Significant Embedded Memory: Approximately 5.37 Mbits of on-chip RAM reduces external memory dependency for buffering and FIFOs.
  • Integrated High-Speed Transceivers: Transceivers up to 6.375 Gbps and dedicated protocol circuitry simplify implementation of serial links and reduce integration time.
  • DSP Acceleration: Dedicated DSP blocks (documented operation up to 550 MHz) accelerate compute-heavy signal processing tasks in hardware.
  • Low-Voltage Operation: Core supply range of 870 mV to 930 mV supports power-efficient system designs.
  • Commercial-Grade Reliability: Operates across 0 °C to 85 °C for standard commercial environments and is RoHS compliant.

Why Choose EP2AGX65DF25C4G?

The EP2AGX65DF25C4G positions itself as a versatile, commercially graded FPGA for designs that require a balance of logic density, embedded memory and high-speed serial connectivity. Its 40-nm low-power architecture, substantial on-chip RAM and DSP resources make it suited for communications, networking, storage interface and DSP-accelerated systems where integration and performance per watt matter.

Designed for engineers and procurement teams seeking a programmable, well-specified FPGA solution, this device offers deterministic hardware resources, integrated protocol support and a compact 572-FBGA footprint to streamline system design and reduce external component count.

Request a quote or submit an inquiry to receive pricing and availability information for the EP2AGX65DF25C4G and to begin your procurement process.

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