EP2AGX65CU17I5G

The EP2AGX65CU17I5G is an Arria II GX field programmable gate array (FPGA) IC in a 358-LFBGA package designed for industrial applications. It combines substantial programmable logic capacity with embedded RAM and a high-density I/O count to support mid-range custom logic, control, and interface functions.

This device is specified for surface-mount assembly and operates across an industrial temperature range, with a defined low-voltage core supply range for system power planning.

Key Features

• Logic Capacity 60,214 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory Approximately 5.37 Mbits of on-chip RAM to support buffering, lookup tables, and local state storage.
• I/O Density 156 user I/O pins to accommodate a wide range of external interfaces and peripherals.
• Package Options 358-LFBGA package with supplier device package listed as 358-UBGA (17×17), suitable for compact board designs.
• Power Core supply voltage range 870 mV to 930 mV to align with low-voltage system architectures.
• Thermal and Mounting Surface-mount device rated for an operating temperature range of −40 °C to 100 °C and graded for industrial use.
• Standards Compliance RoHS compliant.

Typical Applications

• Custom logic and control Use the device’s 60,214 logic elements and embedded RAM to implement tailored state machines, protocol translators, and control logic.
• High-density I/O interfacing Leverage 156 user I/O pins to aggregate and bridge multiple external interfaces or sensor arrays.
• Embedded buffering and data handling Employ approximately 5.37 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary data storage in real-time systems.

Unique Advantages

• Substantial logic integration: 60,214 logic elements provide the capacity to consolidate multiple discrete components into a single programmable device, reducing board-level complexity.
• Significant on-chip memory: Approximately 5.37 Mbits of embedded RAM supports local data storage and minimizes external memory dependencies.
• Robust industrial rating: Rated for −40 °C to 100 °C operation and classified as industrial grade for reliable performance in demanding environments.
• Compact BGA package: 358-LFBGA / 358-UBGA (17×17) packaging enables high-density system integration while supporting surface-mount assembly.
• Defined low-voltage core: 870–930 mV supply range facilitates integration into low-voltage power rails and aids system power budgeting.
• RoHS compliant: Conforms to lead-free and restricted-substance requirements for modern manufacturing processes.

Why Choose EP2AGX65CU17I5G?

The EP2AGX65CU17I5G positions itself as a mid-range Arria II GX FPGA offering a balanced combination of logic density, embedded memory, and I/O capacity within a compact BGA footprint. Its industrial temperature rating and surface-mount BGA package make it suitable for applications that require dependable operation across a wide temperature span and compact PCB integration.

This device is well suited to design teams seeking to consolidate discrete logic and memory functions, implement custom interfaces, or prototype system-level functionality while maintaining clear power and thermal specifications. Its compliance and package details support streamlined manufacturing and long-term design planning.

Request a quote or submit your procurement inquiry today to evaluate EP2AGX65CU17I5G for your next design.