EP2AGX65CU17I3G

The EP2AGX65CU17I3G is an Arria II GX field programmable gate array (FPGA) manufactured by Intel, offered in a 358-LFBGA (358-UBGA, FCBGA) 17×17 package. This industrial-grade device provides a balance of programmable logic capacity, embedded memory, and I/O resources for applications that require reliable operation across a broad temperature range.

Key silicon characteristics include 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and 156 user I/Os. The device supports surface-mount assembly and operates from a 0.87–0.93 V supply within an operating temperature window of −40°C to 100°C.

Key Features

• Programmable Logic  Provides 60,214 logic elements suited for moderate-density programmable logic implementations.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM to support buffering, state machines, and data processing functions.
• I/O Capacity  156 user I/Os to interface with peripherals, sensors, and high-density connectors.
• Power  Core voltage operating range of 0.87–0.93 V for systems with low-voltage supply domains.
• Package and Mounting  358-LFBGA / 358-UBGA (FCBGA) package in a 17×17 footprint, designed for surface-mount assembly.
• Temperature Range  Industrial operating range from −40°C to 100°C for deployment in harsh environments.
• Regulatory Status  RoHS compliant.

Unique Advantages

• Industrial-grade operation: The −40°C to 100°C operating range supports designs that must tolerate extended temperature conditions.
• Balanced logic and memory: 60,214 logic elements paired with ~5.37 Mbits of embedded RAM enables integration of control, data buffering, and protocol logic on a single device.
• Generous I/O count: 156 I/Os provide flexibility for interfacing multiple peripherals and high-pin-count connectors without external multiplexing.
• Compact BGA footprint: 358-LFBGA / 17×17 package allows a dense board layout while maintaining robust thermal and mechanical characteristics for surface-mount assembly.
• Low-voltage core: 0.87–0.93 V supply range aligns with low-power system domains and modern power-rail architectures.
• Environmental compliance: RoHS compliance simplifies regulatory considerations for global manufacturing and procurement.

Why Choose EP2AGX65CU17I3G?

The EP2AGX65CU17I3G positions itself as an industrial-grade Arria II GX FPGA option that combines a substantial logic cell count, meaningful embedded memory, and a high I/O count in a compact 358-LFBGA package. Its operating voltage and temperature specifications make it suitable for designs that need reliable, low-voltage programmable logic across a broad thermal range.

Manufactured by Intel and delivered in a surface-mount BGA form factor, this device is appropriate for engineers and procurement teams seeking a programmable logic solution with clear, verifiable hardware attributes for industrial applications.

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