EP2AGX65CU17C6

The EP2AGX65CU17C6 is an Arria II GX Field Programmable Gate Array (FPGA) from Intel, delivering a balance of programmable logic capacity, on-chip memory, and I/O density in a commercial-grade device. It targets system designs that require mid-range logic resources and flexible I/O in a surface-mount 358-LFBGA package.

With 60,214 logic elements and approximately 5.37 Mbits of embedded RAM, this device is suited for applications that need substantial on-chip logic and memory while operating within standard commercial temperature limits and a low-voltage core supply range.

Key Features

• Logic Capacity — 60,214 logic elements provide solid programmable logic resources for complex finite-state machines, datapaths, and custom hardware accelerators.
• Embedded Memory — Approximately 5.37 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for high-throughput logic functions.
• I/O Density — 156 I/O pins to accommodate multiple peripherals, bus interfaces, and board-level connectivity options.
• Package & Mounting — 358-LFBGA FCBGA package (supplier device package listed as 358-UBGA, 17×17) in a surface-mount form factor for compact board designs.
• Power — Core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Operating Conditions — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Communications and Networking — Leverage the Arria II GX family’s documented transceiver and I/O performance characteristics together with 156 I/Os for packet processing, interfacing, and protocol bridging.
• Signal Processing — Use the device’s 60,214 logic elements and on-chip RAM for data-path acceleration, filtering, and real-time processing tasks.
• System Integration and Prototyping — High logic and memory resources in a compact 358-LFBGA package make the device suitable for proof-of-concept systems and mid-density production designs requiring programmable logic.

Unique Advantages

• Substantial Logic Resource: 60,214 logic elements provide room for sizeable custom logic implementations without immediate need to move to a higher-tier device.
• On-chip Memory for Throughput: Approximately 5.37 Mbits of embedded RAM reduces dependence on external memory for many buffering and streaming tasks.
• Generous I/O Count: 156 I/Os enable flexible board-level interfacing and multiple peripheral connections.
• Compact Surface-Mount Package: The 358-LFBGA (17×17 UBGA footprint) balances board area efficiency with manageable thermal and routing considerations.
• Commercial Temperature Range: Rated for 0 °C to 85 °C for designs targeting commercial-environment deployments.
• Regulatory Compliance: RoHS compliance supports environmentally conscious sourcing and manufacturing requirements.

Why Choose EP2AGX65CU17C6?

The EP2AGX65CU17C6 positions itself as a mid-range programmable logic solution that combines more than 60k logic elements, meaningful embedded memory, and a substantial I/O footprint in a compact surface-mount BGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide set of standard-environment applications where on-chip logic and memory reduce BOM complexity and system latency.

This device is a practical choice for engineers and teams building communications, signal processing, and integration-focused systems who require a programmable platform with clear electrical and packaging characteristics, including a documented core supply range of 870–930 mV and a 0 °C to 85 °C operating window.

Request a quote or submit a pricing inquiry today to evaluate how the EP2AGX65CU17C6 can fit your next FPGA-based design.