EP2AGX65DF25C4

The EP2AGX65DF25C4 is an Arria II GX field programmable gate array (FPGA) in a 572-ball FCBGA package, offered as a commercial-grade surface-mount device. It delivers mid-range logic capacity, embedded memory, and flexible I/O for design tasks that require consolidated digital logic and moderate on-chip buffering.

With 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and 252 user I/O pins, this device is suited to applications that need substantial logic density and I/O count within a compact 25 × 25 mm package footprint. It operates with a core supply voltage in the range 870 mV to 930 mV and is rated for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core logic density — 60,214 logic elements provide significant programmable logic resources for mid-range FPGA designs and logic consolidation.
• Embedded memory — Approximately 5.37 Mbits of on-chip RAM to support buffering, state storage, and moderate data-path requirements.
• I/O capability — 252 user I/O pins enable multiple peripheral interfaces and parallel connectivity in a single device.
• Packaging — 572-ball FCBGA (25 × 25 mm) surface-mount package for compact board-level integration.
• Power — Core voltage operating range of 870 mV to 930 mV to match system power-rail design requirements.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Logic consolidation and prototyping — Use the device to integrate multiple discrete functions into a single FPGA, speeding development and reducing BOM count.
• Interface bridging and protocol glue — High I/O count supports bridging between multiple peripherals and custom interface logic on compact boards.
• On-chip buffering and data handling — Approximately 5.37 Mbits of embedded memory is useful for moderate buffering, FIFOs, and packet or frame storage in data-path designs.

Unique Advantages

• Balanced resource set — Combines a substantial logic element count with sizable embedded memory to address a broad range of mid-complexity designs without overprovisioning.
• Compact package footprint — 572-FBGA, 25 × 25 mm package enables integration into space-constrained PCBs while preserving large I/O capability.
• Predictable power envelope — Narrow core voltage range (870–930 mV) assists in defining power delivery designs and supply selection.
• Commercial-ready operating range — Rated for 0 °C to 85 °C to meet typical commercial electronics deployment environments.
• Compliance-ready — RoHS compliance supports lead‑free manufacturing and regulatory needs.

Why Choose EP2AGX65DF25C4?

The EP2AGX65DF25C4 positions itself as a capable mid-range Arria II GX FPGA that balances logic capacity, on-chip memory, and I/O density in a compact FCBGA package. Its specifications make it a practical choice for design teams seeking to consolidate logic functions, implement interface glue logic, or add moderate buffering without moving to larger, more complex devices.

Its commercial-grade rating and RoHS compliance provide clear integration parameters for volume electronics and consumer-facing products, while the defined supply and temperature ranges help simplify system-level power and thermal planning.

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