EP2AGX65DF25C5

The EP2AGX65DF25C5 is an Intel Arria II GX Field Programmable Gate Array (FPGA) supplied in a 572-ball FCBGA (25×25) package for surface-mount applications. It combines a large pool of programmable logic, on-chip embedded memory, and a broad set of I/O for system-level programmable logic integration.

Designed for commercial-grade applications, the device is offered with a core voltage supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C. The device is RoHS‑compliant.

Key Features

• Logic Capacity — 60,214 logic elements (cells) providing substantial programmable logic resources for complex functions and custom hardware acceleration.
• Logic Array Blocks — 2,530 logic array blocks (LABs/CLBs) for structured logic partitioning and design organization.
• Embedded Memory — Approximately 5.37 Mbits of on-chip RAM to support buffers, state storage, and data-path implementations.
• I/O Resources — 252 user I/O pins to support multiple external interfaces and board-level connectivity.
• Power — Core supply range of 870 mV to 930 mV, enabling designs that target the specified voltage envelope.
• Package & Mounting — 572-ball FCBGA (572‑FBGA, 25×25) package, surface-mountable for modern PCB assembly processes.
• Operating Range — Commercial grade with an ambient operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS‑compliant for environmental and regulatory conformance.
• Documentation — Device family datasheet includes electrical characteristics, transceiver performance specifications, I/O timing, and operating-condition guidance.

Typical Applications

• System Integration and Prototyping — Use the programmable logic and abundant I/O to implement custom system functions and hardware prototypes.
• Data Buffering and Memory Interfaces — On-chip embedded RAM supports buffering, FIFOs, and local data storage within custom logic.
• High‑Density I/O Bridging — With 252 I/O pins, the device can act as an interface bridge between multiple peripherals or subsystems.
• Custom Logic Acceleration — Large logic element count enables offloading of compute or signal-processing tasks into hardware.

Unique Advantages

• Substantial Logic Resources: 60,214 logic elements provide room for complex finite-state machines, datapaths, and custom accelerators.
• Significant Embedded Memory: Approximately 5.37 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage needs.
• Generous I/O Count: 252 user I/Os allow flexible board-level connectivity and multiple interface implementations without additional I/O expanders.
• Compact, Surface‑Mount Package: 572‑FBGA (25×25) package supports high-density PCB layouts while maintaining manufacturability with standard SMT processes.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial electronic product environments.
• Regulatory Compliance: RoHS status ensures conformity with lead-free environmental requirements.

Why Choose EP2AGX65DF25C5?

The EP2AGX65DF25C5 Arria II GX FPGA is positioned for commercial applications that require a balance of programmable logic capacity, embedded memory, and a substantial I/O complement in a compact FCBGA package. Its documented electrical and transceiver characteristics in the device family datasheet provide the technical detail needed for system integration and reliable operation within the specified voltage and temperature ranges.

This device is suitable for engineering teams and procurement looking for a commercially rated, RoHS‑compliant FPGA with ample on‑chip resources and board‑level I/O for implementing custom logic, interfaces, and memory‑centric functions.

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