EP2AGX65DM17I6NAA

The EP2AGX65DM17I6NAA is an Arria II GX field programmable gate array (FPGA) from Intel. It provides a hardware-configurable logic fabric with 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and 156 general-purpose I/O pins.

Designed for industrial environments, this surface-mount device operates from a 0.870–0.930 V supply and across an operating temperature range of −40 °C to 100 °C, enabling use in temperature-demanding applications that require a balance of integration and on-chip resources.

Key Features

• Core Logic  60,214 logic elements provide programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for buffer storage, state machines, and data-path acceleration.
• I/O Density  156 available I/O pins support parallel interfaces and multiple signal connections to external devices.
• Power Supply  Operates from a 0.870–0.930 V supply range to match onboard power-rail requirements.
• Package & Mounting  Surface-mount device suitable for standard PCB assembly processes.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Environmental Compliance  RoHS-compliant construction.

Typical Applications

• FPGA-Based Prototyping  Use the device’s 60,214 logic elements and 156 I/O to prototype and validate complex digital designs on-board.
• Embedded System Acceleration  Approximately 5.37 Mbits of embedded memory enable implementation of hardware accelerators, buffers, and custom data paths within embedded systems.
• Industrial Control and Interfaces  Industrial-grade temperature rating and flexible I/O make the FPGA suitable for control logic, protocol bridging, and sensor/interface aggregation in industrial equipment.

Unique Advantages

• High Logic Capacity: 60,214 logic elements allow integration of substantial custom logic into a single device, reducing the need for multiple discrete components.
• Significant On‑Chip Memory: Approximately 5.37 Mbits of RAM supports data buffering and stateful processing without external memory.
• Robust I/O Count: 156 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and signal routing on dense PCBs.
• Industrial Temperature Operation: −40 °C to 100 °C rating enables deployment in environments with wide temperature swings.
• Low‑Voltage Operation: 0.870–0.930 V supply compatibility helps align the device with modern low-voltage power domains.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory requirements for many product lines.

Why Choose EP2AGX65DM17I6NAA?

The EP2AGX65DM17I6NAA Arria II GX FPGA combines a substantial logic element count, measurable on-chip memory, and a high I/O density into a single industrial‑grade, surface‑mount package. These characteristics make it well suited for designers who need to consolidate logic, accelerate data paths, and implement complex interfacing while maintaining operation across a wide temperature range.

Backed by Intel’s Arria II GX family, this device is targeted at teams seeking a balanced mix of integration and environmental robustness for industrial and embedded projects where deterministic, on‑chip resources and flexible I/O are important design considerations.

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