EP2AGX95DF25C5

The EP2AGX95DF25C5 is an Intel Arria II GX field programmable gate array provided in a 572-ball FCBGA package. It delivers a high-density programmable fabric with a large number of logic elements, substantial on-chip memory, and abundant I/O for mid- to high-complexity embedded logic designs.

Designed for commercial-grade systems, this Arria II GX device targets applications that require configurable logic, plentiful embedded RAM and flexible I/O while operating within a 0 °C to 85 °C ambient range and a core supply window of 870 mV to 930 mV. The device datasheet documents electrical and switching characteristics, transceiver specifications, and I/O timing for system integration and validation.

Key Features

• High Logic Density — 89,178 logic elements to implement complex digital logic, state machines, and custom datapaths.
• Configurable Logic Resources — A large number of programmable resources to map combinational and sequential logic across the device fabric.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffers, FIFOs, and local storage to support memory-intensive functions.
• Generous I/O — 260 I/O pins enable broad interfacing options for parallel buses, peripherals, and external devices.
• Package and Mounting — 572-ball FCBGA (25 × 25 mm) surface-mount package for compact board integration.
• Commercial Grade Operating Range — Rated for 0 °C to 85 °C suitable for standard commercial applications.
• Defined Power Envelope — Core supply range of 870 mV to 930 mV, helping with power budgeting and regulator selection.
• Standards and Compliance — RoHS compliant, supporting environmental and manufacturability requirements.
• Documented Electrical and Switching Characteristics — Device handbook and datasheet include operating conditions, power consumption guidance, transceiver performance specifications, and I/O timing information for system design.

Typical Applications

• High-density digital processing — Use the device’s 89,178 logic elements and embedded memory to implement complex control logic, packet processing, or custom accelerators.
• Interface aggregation — 260 I/O pins provide the connectivity required to consolidate multiple parallel and serial interfaces on a single device.
• Embedded buffering and data staging — Approximately 6.84 Mbits of on-chip RAM supports FIFOs, data buffering, and local storage for streaming data flows.
• Custom board-level integration — The 572-FBGA surface-mount package enables compact PCB layouts for commercial electronic systems.

Unique Advantages

• Substantial programmable capacity: 89,178 logic elements allow designers to implement large-scale logic functions without immediate hardware partitioning.
• Integrated memory resources: Approximately 6.84 Mbits of embedded RAM reduce external memory dependence and simplify board design.
• Ample I/O for system flexibility: 260 I/O pins give designers flexibility to interface with a wide range of peripherals and subsystems.
• Compact package footprint: 572-FBGA (25 × 25 mm) balances high pin count with a manageable PCB area for dense boards.
• Commercial-temperature qualification: Rated 0 °C to 85 °C to match common commercial deployment environments.
• Datasheet-backed integration: Detailed Arria II device documentation covers electrical, switching, and I/O timing data to support robust system design and validation.

Why Choose EP2AGX95DF25C5?

The EP2AGX95DF25C5 Arria II GX FPGA combines a large programmable fabric, substantial embedded memory, and extensive I/O in a compact FCBGA package, making it well suited for commercial embedded designs that require significant on-chip logic and buffering. Its documented electrical and switching characteristics support careful power and timing planning during system integration.

This device is appropriate for design teams seeking a verified, RoHS-compliant FPGA with commercial temperature rating and a clear supply-voltage window for predictable power management. The availability of comprehensive device documentation helps accelerate qualification and deployment within supported operating conditions.

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