EP2AGX95DF25C6

The EP2AGX95DF25C6 is a commercial-grade Arria II GX FPGA offering a high-density programmable logic fabric in a compact BGA package. It is part of the Arria II GX device family and is documented in the Arria II Device Handbook, which covers electrical and switching characteristics including transceiver performance and I/O timing.

This device targets designs that require large logic capacity, substantial on-chip memory, and a high I/O count within a surface-mount 572-ball FCBGA footprint.

Key Features

• Logic Capacity — Approximately 89,178 logic elements to implement complex combinational and sequential logic.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 260 I/O pins to support dense peripheral connectivity and multi-channel interfaces.
• Package & Mounting — 572-ball FCBGA (25 × 25) surface-mount package providing a compact, high-density footprint for PCB integration.
• Power Domain — Core supply range specified at 870 mV to 930 mV to support defined power design and board-level planning.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C suitable for standard commercial deployments.
• Standards Compliance — RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Transceiver and high-speed I/O systems — Use where documented transceiver performance and detailed I/O timing control are required.
• Memory-intensive logic — On-chip RAM capacity supports packet buffering, data staging, and localized storage for streaming tasks.
• High-density peripheral interfacing — 260 I/Os enable multi-channel sensor, control, or peripheral aggregation in a single device.
• Compact board-level integration — The 572-ball FCBGA package allows high-density implementations in space-constrained commercial designs.

Unique Advantages

• High logic integration: Approximately 89,178 logic elements provide the capability to implement large, integrated designs without external logic expansion.
• Substantial on-chip RAM: Approximately 6.84 Mbits of embedded memory reduces dependency on external RAM for many buffering and storage needs.
• High I/O count: 260 I/Os simplify multi-channel connectivity and reduce the need for additional interface devices.
• Compact, manufacturable package: 572-ball FCBGA (25 × 25) surface-mount form factor supports modern PCB assembly and high-density routing.
• Commercial-grade deployment: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
• Defined core power envelope: 870 mV–930 mV core supply range supports predictable power domain design and supply planning.

Why Choose EP2AGX95DF25C6?

EP2AGX95DF25C6 positions itself as a high-capacity, commercially graded Arria II GX FPGA that balances significant logic resources, on-chip memory, and high I/O density in a single 572-ball FCBGA package. Its documented family-level electrical and switching characteristics provide the detail engineers need for board- and system-level integration.

This device is well suited to designers who require a compact, high-density FPGA for commercial applications where substantial embedded memory, many I/Os, and a defined core voltage range are critical to the design. Its RoHS compliance and standard commercial temperature range support mainstream manufacturing and deployment requirements.

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