EP2AGX95DF25C6G

IC FPGA 260 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 260 6839296 89178 572-BGA, FCBGA

Quantity 1,868 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeCommercialOperating Temperature0°C – 85°C
Package / Case572-BGA, FCBGANumber of I/O260Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3747Number of Logic Elements/Cells89178
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95DF25C6G – Arria II GX Field Programmable Gate Array (FPGA), 572-BGA FCBGA

The EP2AGX95DF25C6G is an Intel Arria II GX FPGA supplied in a 572-ball FCBGA package for surface-mount assembly. It provides 89,178 logic elements, approximately 6.84 Mbits of embedded memory and 260 user I/O pins, targeting commercial-grade FPGA designs.

Electrical and environmental specifications include a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity — 89,178 logic elements to implement complex combinational and sequential logic functions.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffers, FIFOs and data storage within the fabric.
  • I/O Density — 260 user I/O pins provide broad external connectivity options for interfaces and peripherals.
  • Power — Core supply operating range from 870 mV to 930 mV to match system power design requirements.
  • Package & Mounting — Available in a 572-BGA (FCBGA) surface-mount package; supplier package listed as 572-FBGA, FC (25×25).
  • Operating Conditions — Commercial grade device specified for 0 °C to 85 °C ambient operation.
  • Regulatory — RoHS compliant for lead-free manufacturing processes.

Unique Advantages

  • Substantial logic resources: 89,178 logic elements enable implementation of sizeable custom logic blocks without immediate partitioning across multiple devices.
  • On-chip RAM capacity: Approximately 6.84 Mbits of embedded memory supports local buffering and high-speed data handling within the FPGA fabric.
  • Flexible I/O count: 260 I/O pins provide design flexibility for multiple parallel interfaces or mixed-signal front ends.
  • Compact surface-mount package: 572-ball FCBGA (25×25) packaging yields a dense footprint suitable for space-constrained PCB layouts.
  • Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns with standard commercial electronics applications.
  • RoHS compliance: Facilitates use in lead-free manufacturing processes and regulatory-aligned production flows.

Why Choose EP2AGX95DF25C6G?

The EP2AGX95DF25C6G combines a high logic element count, meaningful on-chip memory and a 260-pin I/O complement in a compact 572-FBGA surface-mount package, making it suitable for commercial FPGA designs that require significant integration in a single device. Its defined core voltage range and commercial operating temperature make it straightforward to integrate into controlled, production-oriented systems.

Manufactured by Intel and supplied RoHS compliant, this Arria II GX device is targeted at teams seeking a commercially graded FPGA solution with clear, verifiable hardware specifications for system-level planning and procurement.

Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the EP2AGX95DF25C6G.

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