EP2AGX95DF25C6G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 260 6839296 89178 572-BGA, FCBGA |
|---|---|
| Quantity | 1,868 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 260 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3747 | Number of Logic Elements/Cells | 89178 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 6839296 |
Overview of EP2AGX95DF25C6G – Arria II GX Field Programmable Gate Array (FPGA), 572-BGA FCBGA
The EP2AGX95DF25C6G is an Intel Arria II GX FPGA supplied in a 572-ball FCBGA package for surface-mount assembly. It provides 89,178 logic elements, approximately 6.84 Mbits of embedded memory and 260 user I/O pins, targeting commercial-grade FPGA designs.
Electrical and environmental specifications include a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Logic Capacity — 89,178 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffers, FIFOs and data storage within the fabric.
- I/O Density — 260 user I/O pins provide broad external connectivity options for interfaces and peripherals.
- Power — Core supply operating range from 870 mV to 930 mV to match system power design requirements.
- Package & Mounting — Available in a 572-BGA (FCBGA) surface-mount package; supplier package listed as 572-FBGA, FC (25×25).
- Operating Conditions — Commercial grade device specified for 0 °C to 85 °C ambient operation.
- Regulatory — RoHS compliant for lead-free manufacturing processes.
Unique Advantages
- Substantial logic resources: 89,178 logic elements enable implementation of sizeable custom logic blocks without immediate partitioning across multiple devices.
- On-chip RAM capacity: Approximately 6.84 Mbits of embedded memory supports local buffering and high-speed data handling within the FPGA fabric.
- Flexible I/O count: 260 I/O pins provide design flexibility for multiple parallel interfaces or mixed-signal front ends.
- Compact surface-mount package: 572-ball FCBGA (25×25) packaging yields a dense footprint suitable for space-constrained PCB layouts.
- Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns with standard commercial electronics applications.
- RoHS compliance: Facilitates use in lead-free manufacturing processes and regulatory-aligned production flows.
Why Choose EP2AGX95DF25C6G?
The EP2AGX95DF25C6G combines a high logic element count, meaningful on-chip memory and a 260-pin I/O complement in a compact 572-FBGA surface-mount package, making it suitable for commercial FPGA designs that require significant integration in a single device. Its defined core voltage range and commercial operating temperature make it straightforward to integrate into controlled, production-oriented systems.
Manufactured by Intel and supplied RoHS compliant, this Arria II GX device is targeted at teams seeking a commercially graded FPGA solution with clear, verifiable hardware specifications for system-level planning and procurement.
Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the EP2AGX95DF25C6G.

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