EP2AGX95DF25I3N

The EP2AGX95DF25I3N is an Arria II GX field-programmable gate array (FPGA) provided in a 572-ball FCBGA package. It delivers a high logic capacity and substantial on-chip RAM for designs that require dense, reprogrammable logic and embedded memory.

Targeted at industrial-grade applications, this device combines a large count of logic elements, 260 general-purpose I/Os, and a low-voltage core supply to support complex interface and processing functions across a wide operating temperature range.

Key Features

• Logic Capacity — 89,178 logic elements for implementing large-scale logic, control, and custom processing functions.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, lookup tables, and state storage within the device.
• I/O Resources — 260 I/O pins to handle multiple parallel interfaces, signal routing, and system integration tasks.
• Power and Core Supply — Core supply range of 870 mV to 930 mV for the device core and internal logic domains.
• Package and Mounting — 572-FBGA (25 × 25) package, surface-mount mounting type for high-density PCB integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet industrial environmental requirements.
• RoHS Compliant — Device meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density digital processing — Implement custom logic functions, datapath processing, and control logic that require large logic element counts and embedded RAM.
• Interface aggregation and bridging — Consolidate multiple interfaces and I/O signals using the device's high I/O count and reprogrammable logic.
• Industrial control and automation — Deploy in systems that require industrial temperature operation and robust, reconfigurable logic capabilities.

Unique Advantages

• Substantial logic resources — 89,178 logic elements provide the capacity to implement complex state machines, accelerators, and custom logic blocks on a single device.
• Significant on-chip RAM — Approximately 6.84 Mbits of embedded memory reduces external memory dependencies for buffering and lookup functions.
• High I/O density — 260 I/Os enable flexible connectivity and multi-channel interfacing without extensive board-level routing compromises.
• Industrial temperature range — Rated from -40 °C to 100 °C for deployment in demanding environmental conditions.
• Compact, high-pin-count packaging — 572-FBGA (25 × 25) supports high-density PCB layouts while retaining a large pin count for system integration.
• Regulatory compliance — RoHS compliance simplifies integration into lead-free production processes.

Why Choose EP2AGX95DF25I3N?

The EP2AGX95DF25I3N positions itself as a robust, industrial-grade Arria II GX FPGA option for designs that need a combination of high logic density, meaningful embedded RAM, and extensive I/O. Its low-voltage core supply and wide operating temperature range make it suitable for long-life industrial applications that require reliable, reconfigurable hardware.

Engineers and procurement teams looking for a high-capacity FPGA in a compact 572-FBGA package will find this device well suited to consolidate logic, reduce external memory needs, and support dense interface requirements while maintaining RoHS compliance.

Request a quote or submit an inquiry to check pricing and availability for EP2AGX95DF25I3N and to discuss how this FPGA can fit your next design.