EP2AGX95DF25I5G

IC FPGA 260 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 260 6839296 89178 572-BGA, FCBGA

Quantity 834 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case572-BGA, FCBGANumber of I/O260Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3747Number of Logic Elements/Cells89178
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95DF25I5G – Arria II GX FPGA (572-FBGA, Industrial I5)

The EP2AGX95DF25I5G is an Arria II GX field-programmable gate array (FPGA) in a 572-FBGA (25 × 25 mm) surface-mount package. It is an industrial-grade device (I5 speed grade) offering a combination of programmable logic, embedded memory, and I/O density for designs that require flexible hardware acceleration and high I/O count.

Key device metrics include 89,178 logic elements, approximately 6.84 Mbits of embedded memory, and 260 user I/O pins. The device is specified for a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity — 89,178 logic elements provide substantial programmable logic resources for complex glue logic, datapath implementation, and custom hardware functions.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs, and local data storage without external memory.
  • I/O Density — 260 user I/O pins to support parallel interfaces, control signals, and board-level connectivity needs.
  • Package & Mounting — 572-ball FCBGA package (572-FBGA, FC, 25 × 25 mm) designed for surface-mount PCB assembly to minimize board area.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial-temperature applications and harsh environments.
  • Core Voltage Range — Core supply specified from 870 mV to 930 mV to match system power rails and enable predictable power design.
  • Device Family Documentation — Part of the Arria II GX device family; electrical and switching characteristics, including transceiver and PCI Express-related power domains, are described in the device handbook and datasheet.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

  • High-speed serial interfaces — On-chip transceiver and device family support enable implementation of high-speed serial links and protocol endpoints.
  • PCI Express endpoints — Device power domains and PCI Express HIP block references in the device documentation align the device for PCIe-aware designs.
  • Industrial control and automation — Industrial-grade temperature rating and robust I/O count make the device suitable for control, monitoring, and embedded processing in industrial systems.

Unique Advantages

  • Significant programmable logic capacity — 89,178 logic elements allow integration of complex finite-state machines, custom accelerators, and glue logic without external ASICs.
  • On-chip memory for local buffering — Approximately 6.84 Mbits of embedded RAM reduces reliance on external memory for latency-sensitive tasks.
  • High I/O count — 260 I/O pins simplify board routing for multi-channel interfaces and mixed-signal control.
  • Industrial operating range — Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
  • Compact BGA footprint — 572-FBGA package enables a dense PCB layout while providing the required ball count for power and I/O.
  • Clear power specification — Defined core supply range (870 mV–930 mV) facilitates power-supply design and validation.

Why Choose EP2AGX95DF25I5G?

The EP2AGX95DF25I5G brings together a substantial logic element count, multiple megabits of embedded RAM, and a high I/O count in a compact 572-FBGA package, all within an industrial temperature envelope. These characteristics make it well suited to designs that require on-chip processing, protocol endpoints, and dense interfacing while maintaining predictable power and thermal behavior.

As part of the Arria II GX family, the device is documented in the Arria II device handbook and datasheet, providing the electrical and switching specifications needed for system integration and validation. Choose this device when your project requires a field-programmable solution with verified device-level specifications for industrial applications.

Request a quote or submit an inquiry for pricing and availability to begin integrating EP2AGX95DF25I5G into your design. Include your required quantities and any lead-time considerations for a tailored response.

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