EP2AGX95EF29C4G

The EP2AGX95EF29C4G is an Arria II GX field programmable gate array (FPGA) from Intel, provided in a 780-BBGA FCBGA package (supplier device package listed as 780-FBGA, 29×29). It delivers a high-capacity programmable logic fabric with extensive on-chip memory and a large I/O count for designs that require significant logic resources and connectivity.

Targeted at commercial-grade applications, this device combines approximately 6.84 Mbits of embedded memory, 89,178 logic elements, and 372 I/Os to support complex, highly integrated digital designs while operating within a core supply voltage range of 870 mV to 930 mV and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Large Logic Capacity  89,178 logic elements provide substantial programmable logic for complex algorithms and custom digital functions.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• High I/O Count  372 I/O pins enable broad peripheral and system connectivity for multi-channel interfaces and dense board-level integration.
• Power and Core Voltage  Core supply operating range of 870 mV to 930 mV to match system power-rail requirements within specified limits.
• Commercial Grade & RoHS Compliant  Commercial temperature grade (0 °C to 85 °C) and RoHS compliance for standard commercial product deployments.
• Package & Mounting  780-BBGA FCBGA package with surface-mount mounting; supplier device package listed as 780-FBGA (29×29) for compact, high-density board designs.
• Manufacturer Documentation  Part of the Arria II GX device family documented in the Arria II Device Handbook, which details electrical characteristics and transceiver and I/O timing guidance.

Typical Applications

• High-density digital processing  Use the device where large programmable logic resources and on-chip RAM are needed to implement custom processing pipelines and state machines.
• Multi-interface systems  The 372 I/Os support designs requiring multiple parallel interfaces, sensor arrays, or board-level I/O expansion.
• Embedded control and acceleration  Leverage the combination of logic and embedded memory for hardware acceleration of compute tasks and embedded system control.

Unique Advantages

• High integration density: 89,178 logic elements and sizable embedded RAM reduce reliance on external components and simplify system architecture.
• Extensive I/O connectivity: 372 I/Os help accommodate complex peripheral mixes and multi-channel designs without extensive board routing compromises.
• Compact package footprint: 780-BBGA FCBGA (supplier package 780-FBGA, 29×29) enables high-density PCB placement for space-constrained applications.
• Commercial deployment-ready: Rated for operation from 0 °C to 85 °C with RoHS compliance for standard commercial electronic product environments.
• Established device family documentation: Arria II GX family datasheets and device handbook provide electrical and timing specifications to support design and validation.

Why Choose EP2AGX95EF29C4G?

The EP2AGX95EF29C4G positions itself as a high-capacity, commercially graded FPGA option for designs that require substantial programmable logic, on-chip memory, and extensive I/O in a compact BGA package. Its specification set—89,178 logic elements, approximately 6.84 Mbits of embedded memory, 372 I/Os, and defined core voltage and temperature ranges—makes it suitable for complex digital systems where integration density and predictable operating conditions matter.

Backed by Arria II GX device family documentation, this part is appropriate for engineering teams seeking a documented, commercially rated FPGA platform to implement custom logic, I/O-rich subsystems, and embedded acceleration while maintaining a compact board footprint.

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