EP2AGX95EF29C5

The EP2AGX95EF29C5 is an Arria II GX field programmable gate array (FPGA) from Intel, offered in a 780-ball FBGA (29×29) package for surface-mount assembly. The device combines a high logic element count, substantial on-chip RAM, and a large I/O complement for dense, I/O‑rich designs.

Designed for commercial-grade applications, this Arria II GX device supports core supply voltages between 870 mV and 930 mV and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard embedded and communications platforms.

Key Features

• Logic Capacity — 89,178 logic elements (cells), providing significant programmable fabric for complex digital functions and custom logic implementation.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, packet handling, and memory-intensive logic functions.
• I/O Resources — 372 user I/O pins to accommodate high pin-count interfaces and multiple parallel or serial connections.
• Package & Mounting — 780-ball FCBGA (29×29) package, surface-mount mounting type for board-level integration in compact systems.
• Power Supply — Core supply operating range of 870 mV to 930 mV to match system power-rail requirements.
• Commercial Grade & Temperature — Rated for commercial-grade operation across 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
• Arria II GX Series Documentation — Supported by the Arria II Device Handbook and device datasheet for electrical and switching characteristics.

Typical Applications

• High-density logic integration — Implement complex state machines, protocol handlers, and custom accelerators using the device’s 89,178 logic elements.
• Memory‑intensive processing — Leverage approximately 6.84 Mbits of embedded RAM for packet buffering, FIFO structures, and temporary data storage.
• I/O-rich systems — Use the 372 I/O pins to interface multiple peripherals, parallel buses, or I/O standards in communications and instrumentation equipment.
• Commercial embedded platforms — Suitable for commercial products and prototypes that operate within the specified 0 °C to 85 °C range and voltage requirements.

Unique Advantages

• Substantial logic density: 89,178 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM helps minimize external memory dependency and simplify routing and BOM.
• Large I/O count: 372 user I/O pins provide flexibility to support numerous interfaces or wide parallel buses without external expanders.
• Compact BGA packaging: 780‑FBGA (29×29) provides a high-pin-count solution in a compact surface-mount form factor for space-constrained designs.
• Commercial temperature and RoHS compliance: Clear operating range and environmental compliance simplify qualification for standard commercial products.

Why Choose EP2AGX95EF29C5?

The EP2AGX95EF29C5 delivers a balanced combination of programmable logic capacity, on-chip RAM, and extensive I/O in a single Arria II GX device. Its commercial-grade temperature rating, defined core voltage range, and RoHS compliance make it suitable for mainstream embedded and communications applications that require a high integration level without resorting to multiple discrete devices.

Engineers building mid- to high-density FPGA designs will find the device’s logic density and embedded memory useful for consolidating functions, while the 780-FBGA package eases integration into compact PCBs. Documentation provided in the Arria II Device Handbook and device datasheet supports electrical characterization and system-level integration.

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