EP2AGX95EF29C5N

The EP2AGX95EF29C5N is an Intel Arria II GX family Field Programmable Gate Array supplied in a 780-BBGA FCBGA package. This commercial-grade FPGA delivers substantial programmable logic capacity and high I/O density for complex, board-level digital designs.

With 89,178 logic elements, approximately 6.84 Mbits of embedded memory, and up to 372 I/O pins, the device is well suited to I/O‑dense and logic‑intensive FPGA implementations where compact package and surface-mount assembly are required.

Key Features

• Logic Capacity  Provides 89,178 logic elements for implementing custom digital functions and moderate to high logic densities.
• Embedded Memory  Approximately 6.84 Mbits of on‑chip RAM to support buffering, lookup tables, and embedded state storage.
• I/O Resources  Up to 372 user I/O pins to support dense interfacing requirements in multi‑signal systems.
• Package & Mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑FBGA (29×29). Surface‑mount mounting type for standard PCB assembly.
• Power  Core supply operating range from 870 mV to 930 mV for core power planning and board regulator selection.
• Operating Temperature  Commercial temperature rating from 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density I/O systems  Use the 372 available I/O pins to interface multiple peripherals, sensors, or parallel buses on a single FPGA.
• Custom digital acceleration  Leverage 89,178 logic elements and embedded RAM to implement application‑specific datapaths and hardware accelerators.
• Embedded system prototyping  Compact FCBGA packaging and surface‑mount assembly enable integration into prototype and production PCBs for commercial designs.

Unique Advantages

• High programmable logic density: 89,178 logic elements enable substantial on‑chip implementation of custom logic without external gate arrays.
• Significant on‑chip memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for many buffering and state‑storage tasks.
• I/O scalability: 372 I/O pins allow flexible connectivity and support for multi‑lane interfaces or numerous peripheral signals.
• Compact, production‑ready package: 780‑BBGA (29×29 FCBGA) supports dense board integration and standard surface‑mount assembly flows.
• Commercial operating range: Rated for 0 °C to 85 °C and RoHS compliant for commercial product deployments.
• Defined core voltage window: 870 mV to 930 mV core supply range simplifies power supply selection and thermal/power budgeting.

Why Choose EP2AGX95EF29C5N?

The EP2AGX95EF29C5N combines the Arria II GX family’s device characteristics with a high logic element count, substantial embedded memory, and a high‑density I/O complement in a compact FCBGA package. Its defined core voltage range and commercial temperature rating make it suitable for a wide range of board‑level digital designs requiring programmable logic and dense external interfacing.

This device is appropriate for design teams seeking a commercially rated FPGA with a balance of logic capacity, on‑chip memory, and I/O resources that can be integrated into surface‑mount PCBs and supported by the Arria II device documentation.

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