EP2AGX95EF29C6N

The EP2AGX95EF29C6N is an Arria II GX field-programmable gate array (FPGA) from Intel designed for systems that require substantial programmable logic, embedded memory, and a high I/O count. As a commercial-grade Arria II GX device, it provides a balance of integration and performance for complex digital designs.

The device integrates a large number of logic elements, embedded RAM, and programmable I/O in a 780-ball FCBGA (29×29) surface-mount package, with operating conditions and switching characteristics documented in the Arria II device handbook.

Key Features

• Logic Capacity  Approximately 89,178 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 6.839296 Mbits of on-chip RAM, suitable for buffering, state storage, and small data tables.
• I/O Density  372 user I/Os to support wide buses, multiple interfaces, and parallel peripherals.
• Package and Mounting  780-FBGA (29×29) FCBGA package in a surface-mount form factor for compact board-level integration.
• Core Voltage Range  Core supply range of 870 mV to 930 mV to match system power rails and design requirements.
• Commercial Temperature Grade  Specified operating temperature range of 0 °C to 85 °C for commercial applications.
• Arria II GX Device Family Documentation  Electrical and switching characteristics, including transceiver and I/O timing information, are provided in the Arria II device handbook.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital logic  Implement custom digital functions and control logic where a large number of logic elements and programmable routing are required.
• Memory-backed processing blocks  Use the on-chip RAM for buffering, FIFOs, and small embedded data structures in control and signal-processing pipelines.
• Multi-interface systems  Support designs that require many parallel or serial I/Os for peripheral aggregation, sensor interfaces, or board-level bridging.

Unique Advantages

• Substantial logic resources:  Approximately 89k logic elements enable implementation of large or partitioned designs without immediate need for external logic expansion.
• Significant embedded memory:  Approximately 6.84 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage tasks.
• High I/O count:  372 I/Os provide flexibility for wide buses and multiple simultaneous interfaces, simplifying board-level design.
• Compact FCBGA package:  780-ball (29×29) surface-mount package delivers high integration density for space-constrained PCBs.
• Commercial-grade operating range:  0 °C to 85 °C specification aligns with a broad set of commercial electronics applications.
• RoHS compliance:  Designed to meet common environmental and supply-chain requirements.

Why Choose EP2AGX95EF29C6N?

The EP2AGX95EF29C6N delivers a balanced mix of logic capacity, embedded memory, and high I/O density in a compact FCBGA package, making it suitable for complex commercial designs that require substantial on-chip resources. Its documented electrical and switching characteristics in the Arria II device handbook help engineers validate timing, power, and I/O behavior during system integration.

This part is well suited to teams developing systems that need scalable programmable logic, substantial embedded RAM, and dense I/O routing while operating within commercial temperature and core-voltage ranges.

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