EP2AGX95EF29I3

The EP2AGX95EF29I3 is an Intel Arria II GX field programmable gate array (FPGA) offered in a 780-FBGA (29×29) FCBGA package. Designed for industrial-grade applications, it provides a balance of on-chip logic capacity, embedded memory, and extensive I/O to support complex, space-constrained designs.

Its core characteristics—logic density, embedded RAM, and I/O count—make it suitable for applications that require significant programmable logic, memory resources, and board-level integration while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 89,178 logic elements to implement complex digital designs and custom processing architectures.
• Embedded Memory — Approximately 6.8 Mbits of on-chip RAM to support buffering, state storage, and lookup-table implementations.
• I/O Resources — 372 I/O pins to accommodate extensive external interfacing and peripheral connections.
• Package & Mounting — 780-FBGA (29×29) FCBGA / 780-BBGA package in a surface-mount form factor for high-density board integration.
• Power — Specified voltage supply range of 870 mV to 930 mV, enabling precise core power sequencing and design planning.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Standards & Compliance — RoHS compliant for environmental regulatory alignment.
• Family-Level Capabilities (per device handbook) — Arria II GX family documentation includes electrical and transceiver performance specifications, I/O timing, and support for high-speed interface blocks referenced in the device datasheet.

Typical Applications

• High-density digital processing — Implements complex logic and custom datapaths using the FPGA’s 89,178 logic elements and embedded RAM.
• Board-level interface aggregation — 372 I/O pins enable consolidation of multiple peripheral and sensor interfaces on a single FPGA.
• Industrial control and instrumentation — Industrial temperature rating (−40 °C to 100 °C) and robust package options support harsh-environment deployments.
• High-bandwidth serial and protocol bridging — Family datasheet references transceiver and PCIe-related blocks useful for designs requiring high-speed serial links and protocol interfacing.

Unique Advantages

• Substantial logic capacity: 89,178 logic elements enable implementation of complex state machines, DSP pipelines, and custom accelerators without external logic.
• Integrated on-chip memory: Approximately 6.8 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup tables.
• Extensive I/O count: 372 I/Os simplify system partitioning by allowing more direct connections to peripherals and daughter cards.
• Industrial thermal range: −40 °C to 100 °C operation supports deployment in temperature-critical industrial environments.
• Compact, surface-mount package: 780-FBGA (29×29) FCBGA provides a high-pin-count, compact solution for space-constrained PCBs.
• Regulatory alignment: RoHS compliance supports use in designs with environmental directive requirements.

Why Choose EP2AGX95EF29I3?

The EP2AGX95EF29I3 brings a combination of significant programmable logic, substantial embedded memory, and a large I/O complement in a compact FCBGA package, tailored for industrial-grade applications. Its specified operating voltage range and broad temperature rating support robust system-level design and operational planning.

This device is well suited to engineering teams developing complex, board-integrated FPGA solutions that require a balance of logic density, on-chip RAM, and interfacing capability while meeting industrial environmental requirements.

Request a quote or submit a procurement inquiry today to discuss availability, pricing, and lead times for the EP2AGX95EF29I3.