EP2AGX95EF29I5
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 372 6839296 89178 780-BBGA, FCBGA |
|---|---|
| Quantity | 98 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3747 | Number of Logic Elements/Cells | 89178 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6839296 |
Overview of EP2AGX95EF29I5 – Arria II GX FPGA, 780-BBGA FCBGA
The EP2AGX95EF29I5 is an Arria II GX field programmable gate array (FPGA) from Intel, delivered in a 780-BBGA FCBGA package. It combines a high count of logic resources, substantial on-chip memory, and a large number of I/O to address compute- and I/O-intensive embedded designs in industrial environments.
Engineered for applications that need dense programmable logic, multi-megabit embedded memory, and transceiver/I/O capabilities documented in the device datasheet, this device is suited to systems that require robust temperature range and RoHS-compliant surface-mount packaging.
Key Features
- Core logic density — Provides 89,178 logic elements and 3,747 logic blocks to implement complex digital systems and custom accelerators.
- Embedded memory — Approximately 6.84 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
- I/O capacity — 372 I/O pins to support dense peripheral connectivity and multi-channel interfacing.
- Transceivers and programmable I/O — Device handbook and datasheet coverage includes transceiver performance specifications plus programmable I/O element and output buffer timing for flexible signal timing control.
- Power domain — Core supply operating range specified at 870 mV to 930 mV, enabling defined power budgeting for board-level design.
- Industrial temperature range — Rated for operation from −40 °C to 100 °C, supporting deployment in thermally demanding environments.
- Package and mounting — 780-BBGA (FCBGA) package, supplier package 780-FBGA (29×29), optimized for surface-mount assembly.
- Regulatory status — RoHS compliant.
Typical Applications
- Industrial controls and automation — Industrial-grade temperature rating and high I/O count enable real-time control, sensor interfacing, and deterministic logic for factory and process systems.
- High-density custom logic — Large logic element count and embedded memory support complex algorithms, protocol processing, and custom hardware acceleration.
- High-throughput data paths — Documented transceiver and programmable I/O timing make the device appropriate for systems requiring controlled high-speed serial or parallel data movement.
- Prototyping and system integration — Surface-mount 780-BBGA package and comprehensive datasheet coverage simplify evaluation and integration into space-constrained boards.
Unique Advantages
- Significant logic resources: 89,178 logic elements and 3,747 logic blocks provide capacity for large, multi-function designs without external logic expansion.
- Multi-megabit on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
- High I/O integration: 372 I/O pins allow flexible interfacing to peripherals, sensors, and multi-lane data links on a single device.
- Industrial-ready thermal range: −40 °C to 100 °C operating range supports deployment in harsh and industrial environments.
- Defined power envelope: Core voltage range of 0.87–0.93 V simplifies power supply design and system-level power planning.
- Standards-compliant packaging: 780-BBGA (29×29) surface-mount package and RoHS compliance support modern assembly processes and regulatory expectations.
Why Choose EP2AGX95EF29I5?
The EP2AGX95EF29I5 Arria II GX FPGA delivers a balance of dense logic, substantial embedded memory, and broad I/O in a RoHS-compliant FCBGA package. Its industrial temperature rating and documented transceiver and I/O timing features make it suitable for demanding embedded and communications-oriented applications that require configurable hardware and reliable thermal performance.
This device is appropriate for engineering teams designing systems that need scalable logic capacity, on-chip memory for performance-critical tasks, and a high pin-count I/O interface in a surface-mount form factor. The datasheet provides detailed electrical and switching characteristics to support system integration and verification.
To request pricing, lead-time, or a formal quote for EP2AGX95EF29I5, submit a sourcing inquiry or quote request with your quantity and required delivery timeline.

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