EP2AGX95EF35C4G

The EP2AGX95EF35C4G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35) package. It provides a programmable logic fabric with substantial on‑chip memory and a large number of I/O for designs that require flexible, high‑density integration.

With 89,178 logic elements, approximately 6.84 Mbits of embedded memory and 452 user I/O, this commercial‑grade device targets applications that need significant programmable logic, substantial embedded RAM, and broad interfacing capability while operating within a 0 °C to 85 °C temperature range and a core supply of 870 mV to 930 mV.

Key Features

• Logic Capacity — 89,178 logic elements provide a large programmable fabric for complex digital designs and custom processing pipelines.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM to support buffering, frame storage, and intermediate data processing without external memory for many use cases.
• I/O and Packaging — 452 user I/O in a 1152‑FBGA (35×35) package enables high‑pin‑count interfacing for parallel buses, multi‑lane peripherals, and dense connector routing.
• Power Supply — Core voltage range of 870 mV to 930 mV for precise power planning and compatibility with targeted power domains.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial and enterprise applications.
• Compliance — RoHS compliant, supporting lead‑free production and assembly processes.

Typical Applications

• High‑density I/O Bridging — Use the 452 I/O to implement protocol bridging, bus interfacing, and custom I/O logic between multiple subsystems.
• Data and Signal Processing — Leverage the large logic element count and on‑chip RAM for signal conditioning, filtering, and mid‑pipeline data buffering.
• Video and Image Processing — Deploy embedded memory and logic resources for frame buffering, pixel processing, and real‑time pipeline implementations.
• Prototyping and Custom Logic — Suitable for development platforms that require reconfigurable hardware with substantial logic and memory for algorithm validation.

Unique Advantages

• High Logic Density: 89,178 logic elements allow implementation of complex state machines, parallel datapaths, and custom accelerators without immediate need for multiple devices.
• Significant On‑chip RAM: Approximately 6.84 Mbits of embedded memory reduces reliance on external RAM for many buffering and caching tasks, simplifying board layout.
• Large I/O Count: 452 user I/O simplifies interfacing to multiple peripherals and high‑pin connectors, reducing the need for external multiplexing.
• Compact High‑pin Package: 1152‑FBGA (35×35) provides a high‑density footprint for space‑constrained designs requiring many signals.
• Commercial Temperature Rating: 0 °C to 85 °C supports standard commercial deployments and structured thermal management.
• RoHS Compliant: Conforms to lead‑free manufacturing requirements for modern production environments.

Why Choose EP2AGX95EF35C4G?

The EP2AGX95EF35C4G combines substantial logic capacity, meaningful embedded memory, and a high I/O count in a compact 1152‑FBGA package from Intel. Its specification set is well suited to engineers who need a reconfigurable platform capable of handling complex processing tasks and broad interfacing requirements within commercial temperature and power envelopes.

This device fits designs where integration density and on‑chip resources reduce bill‑of‑materials and simplify board design, providing a scalable solution for prototyping and production deployments backed by Intel's FPGA family ecosystem.

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