EP2AGX95EF35C5
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 452 6839296 89178 1152-BBGA, FCBGA |
|---|---|
| Quantity | 403 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 452 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3747 | Number of Logic Elements/Cells | 89178 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6839296 |
Overview of EP2AGX95EF35C5 – Arria II GX FPGA, 1152‑FBGA, 452 I/O, 89,178 Logic Elements
The EP2AGX95EF35C5 is an Intel Arria II GX field programmable gate array supplied in a 1152‑FBGA (35×35) package for surface‑mount assembly. It delivers a large logic capacity and on‑chip memory suitable for complex programmable logic designs in commercial applications.
Engineered for integration and flexibility, the device provides a high I/O count, substantial embedded memory, and a defined core voltage operating window, enabling designers to implement dense logic, buffering, and I/O‑rich systems within a compact package.
Key Features
- Logic Capacity — 89,178 logic elements to implement complex custom logic, state machines, and data paths.
- Embedded Memory — Approximately 6.84 Mbits of embedded memory for on‑chip buffering, FIFOs, and distributed storage.
- I/O Count — 452 general‑purpose I/O pins to support broad peripheral and bus connectivity requirements.
- Package & Mounting — 1152‑BBGA (FCBGA) / supplier package 1152‑FBGA (35×35) in a surface‑mount format for compact board designs.
- Power Supply — Core supply operating between 870 mV and 930 mV, providing a defined supply window for system power planning.
- Operating Grade & Temperature — Commercial grade with an operating range of 0°C to 85°C for standard commercial environments.
- Environmental Compliance — RoHS compliant to support regulatory and assembly requirements.
Unique Advantages
- High integration density: Nearly 90K logic elements and multi‑Mbit embedded memory enable consolidation of complex functions on a single device, reducing board count and BOM complexity.
- Extensive I/O support: 452 I/O pins allow direct interfacing to numerous peripherals, buses, and external devices without needing additional I/O expanders.
- Compact surface‑mount packaging: 1152‑FBGA (35×35) footprint supports space‑constrained designs while providing a large pin count for high connectivity.
- Defined core voltage window: 870–930 mV supply range simplifies power‑supply design and ensures consistent core operation within specified limits.
- Commercial temperature suitability: Rated for 0°C to 85°C operation to meet typical commercial application environments.
- Regulatory readiness: RoHS compliance assists compliance with lead‑free assembly and environmental standards.
Why Choose EP2AGX95EF35C5?
The EP2AGX95EF35C5 Arria II GX FPGA combines a large logic fabric, multi‑Mbit embedded memory, and a high I/O count in a compact 1152‑FBGA package, making it well suited to commercial designs that require significant programmable resources and dense interfacing. Its clearly specified core voltage range and commercial temperature rating support reliable integration into production systems.
This device is appropriate for engineering teams seeking a high‑capacity, RoHS‑compliant programmable platform that balances logic density, on‑chip memory, and I/O availability within a surface‑mount BGA footprint.
Request a quote or submit a request to receive pricing and availability for EP2AGX95EF35C5.

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