EP2AGX95EF35C5

IC FPGA 452 I/O 1152FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 452 6839296 89178 1152-BBGA, FCBGA

Quantity 403 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O452Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3747Number of Logic Elements/Cells89178
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95EF35C5 – Arria II GX FPGA, 1152‑FBGA, 452 I/O, 89,178 Logic Elements

The EP2AGX95EF35C5 is an Intel Arria II GX field programmable gate array supplied in a 1152‑FBGA (35×35) package for surface‑mount assembly. It delivers a large logic capacity and on‑chip memory suitable for complex programmable logic designs in commercial applications.

Engineered for integration and flexibility, the device provides a high I/O count, substantial embedded memory, and a defined core voltage operating window, enabling designers to implement dense logic, buffering, and I/O‑rich systems within a compact package.

Key Features

  • Logic Capacity — 89,178 logic elements to implement complex custom logic, state machines, and data paths.
  • Embedded Memory — Approximately 6.84 Mbits of embedded memory for on‑chip buffering, FIFOs, and distributed storage.
  • I/O Count — 452 general‑purpose I/O pins to support broad peripheral and bus connectivity requirements.
  • Package & Mounting — 1152‑BBGA (FCBGA) / supplier package 1152‑FBGA (35×35) in a surface‑mount format for compact board designs.
  • Power Supply — Core supply operating between 870 mV and 930 mV, providing a defined supply window for system power planning.
  • Operating Grade & Temperature — Commercial grade with an operating range of 0°C to 85°C for standard commercial environments.
  • Environmental Compliance — RoHS compliant to support regulatory and assembly requirements.

Unique Advantages

  • High integration density: Nearly 90K logic elements and multi‑Mbit embedded memory enable consolidation of complex functions on a single device, reducing board count and BOM complexity.
  • Extensive I/O support: 452 I/O pins allow direct interfacing to numerous peripherals, buses, and external devices without needing additional I/O expanders.
  • Compact surface‑mount packaging: 1152‑FBGA (35×35) footprint supports space‑constrained designs while providing a large pin count for high connectivity.
  • Defined core voltage window: 870–930 mV supply range simplifies power‑supply design and ensures consistent core operation within specified limits.
  • Commercial temperature suitability: Rated for 0°C to 85°C operation to meet typical commercial application environments.
  • Regulatory readiness: RoHS compliance assists compliance with lead‑free assembly and environmental standards.

Why Choose EP2AGX95EF35C5?

The EP2AGX95EF35C5 Arria II GX FPGA combines a large logic fabric, multi‑Mbit embedded memory, and a high I/O count in a compact 1152‑FBGA package, making it well suited to commercial designs that require significant programmable resources and dense interfacing. Its clearly specified core voltage range and commercial temperature rating support reliable integration into production systems.

This device is appropriate for engineering teams seeking a high‑capacity, RoHS‑compliant programmable platform that balances logic density, on‑chip memory, and I/O availability within a surface‑mount BGA footprint.

Request a quote or submit a request to receive pricing and availability for EP2AGX95EF35C5.

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