EP2AGX95EF35C6

IC FPGA 452 I/O 1152FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 452 6839296 89178 1152-BBGA, FCBGA

Quantity 548 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O452Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3747Number of Logic Elements/Cells89178
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95EF35C6 – Arria II GX FPGA, 1152-FBGA (35×35)

The EP2AGX95EF35C6 is an Intel Arria II GX field-programmable gate array supplied in a 1152-ball FCBGA package. It provides a high logic capacity device with substantial embedded memory and a large I/O count for complex, programmable hardware designs.

Presented as a commercial-grade device, this FPGA is designed for applications that require configurable logic, on-chip memory, and extensive I/O connectivity while operating within a core voltage range of 870 mV to 930 mV and an ambient temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 89,178 logic elements organized into 3,747 logic blocks, enabling large-scale programmable logic implementations.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, look-up tables, and local data storage.
  • I/O Density — 452 I/O pins to support wide parallel interfaces and diverse peripheral connectivity.
  • Package & Mounting — 1152-ball FCBGA (35×35 mm) package in a surface-mount form factor suitable for high-density PCB designs.
  • Power — Core supply operating range of 0.870 V to 0.930 V, enabling defined power budgeting for system design.
  • Operating Conditions — Commercial grade with an ambient operating temperature range of 0 °C to 85 °C.
  • Standards Compliance — RoHS compliant.
  • Device Documentation — Arria II device handbook includes detailed electrical characteristics, transceiver performance specifications, and programmable I/O timing information.

Typical Applications

  • High-speed communications equipment — Use the device’s extensive I/O and documented transceiver specifications for protocol bridging and interface implementations.
  • Embedded compute and signal processing — Leverage the large logic element count and approximately 6.84 Mbits of embedded memory for on-device data processing and custom accelerators.
  • Data acquisition and control — The combination of high I/O density and programmable logic enables flexible measurement, aggregation, and control functions.
  • Prototyping and system integration — Suitable for integrating custom IP, peripheral interfaces, and logic functions in compact, surface-mount designs.

Unique Advantages

  • High logic density: 89,178 logic elements provide capacity for complex finite-state machines, datapaths, and custom accelerators.
  • Substantial on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces external memory dependencies for many use cases.
  • Extensive I/O connectivity: 452 I/O pins support broad interfacing options and parallel data paths.
  • Defined power envelope: Core voltage range of 0.870–0.930 V helps with predictable power planning and thermal design.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation for typical commercial application environments.
  • RoHS compliant: Environmentally compliant for deployment in RoHS-regulated assemblies.

Why Choose EP2AGX95EF35C6?

The EP2AGX95EF35C6 Arria II GX FPGA balances high logic capacity, significant embedded memory, and a large I/O count in a compact 1152-ball FCBGA package. Its documented electrical and transceiver characteristics support deterministic integration into designs that require programmable logic, local memory, and robust interface support within a commercial temperature range.

This device is well suited to engineering teams designing mid-to-high complexity FPGA-based systems that need clear specification boundaries for power, temperature, and I/O capacity, backed by the Arria II device documentation for electrical and timing details.

Request a quote or submit an inquiry for EP2AGX95EF35C6 to receive pricing and availability information for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up