EP2AGX95EF35C6G

The EP2AGX95EF35C6G is an Intel Arria II GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package designed for configurable digital logic and high-density I/O implementations. It delivers a large logic fabric and on-chip memory to support complex, customizable designs within commercial-temperature applications.

With 89,178 logic elements, approximately 6.84 Mbits of embedded memory, and 452 I/O pins, this FPGA addresses applications that require significant logic capacity, on-chip buffering and flexible interfacing while adhering to RoHS environmental requirements.

Key Features

• Logic Capacity — 89,178 logic elements to implement complex programmable logic, combinational logic and state machines.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for data buffering, FIFOs and local storage of intermediate results.
• I/O Density — 452 I/O pins to support multiple external interfaces and high-pin-count system integrations.
• Package — 1152-ball FCBGA package listed as 1152-FBGA (35×35), providing a compact surface-mount footprint for high-density board designs.
• Power Supply — Core operating voltage range of 0.870 V to 0.930 V to match system power-rail designs.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Mounting and Compliance — Surface-mount package and RoHS compliant for standard commercial manufacturing and environmental requirements.

Typical Applications

• High-density digital processing — Implement custom parallel processing pipelines and protocol handling using the large logic element count.
• Interface bridging and I/O expansion — Use the 452 I/O pins to consolidate and translate multiple external interfaces on a single device.
• On-chip buffering and memory tasks — Leverage approximately 6.84 Mbits of embedded RAM for FIFOs, packet buffering or temporary data storage.

Unique Advantages

• Substantial logic resources: 89,178 logic elements provide headroom for complex custom logic and multi-function designs.
• Significant embedded memory: Approximately 6.84 Mbits of on-chip RAM reduces external memory dependency for many buffering and storage needs.
• High I/O count: 452 I/O pins enable flexible connectivity and reduce the need for additional interface components.
• Compact, manufacturable package: 1152-ball FCBGA surface-mount package supports dense PCB layouts while remaining RoHS compliant.
• Commercial-temperature operation: Rated 0 °C to 85 °C to match standard commercial system requirements.

Why Choose EP2AGX95EF35C6G?

The EP2AGX95EF35C6G positions itself as a high-capacity, commercially graded FPGA option for designs that require a combination of substantial logic resources, on-chip memory and extensive I/O. Its package and supply-voltage characteristics fit well into compact, surface-mount system designs where integration density and configurable logic are priorities.

This device is well suited to engineering teams and OEMs building configurable digital subsystems that benefit from on-chip RAM and a large number of interfacing pins, offering design scalability and adherence to RoHS requirements.

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