EP2AGX95EF35C6ES

The EP2AGX95EF35C6ES is an Intel Arria II GX field programmable gate array (FPGA) in a 1152‑FBGA (35×35) package. It provides high-density logic resources, embedded memory, and a large user I/O count for complex, multi‑interface digital designs.

With approximately 89,178 logic elements, roughly 6.84 Mbits of on‑chip RAM, and 452 user I/Os, this commercial‑grade surface‑mount FPGA targets applications that require integrated logic, memory buffering, and flexible I/O routing within a compact package.

Key Features

• Logic Capacity — Approximately 89,178 logic elements for implementing complex digital functions and custom datapaths.
• Embedded Memory — Approximately 6.84 Mbits of total on‑chip RAM for buffering, packet memory, and local data storage.
• I/O Resources — 452 user I/Os to support multi‑lane interfaces, parallel buses, and mixed signaling requirements.
• Core Voltage — Low‑voltage core supply range of 0.870 V to 0.930 V to align with power budgets and system power architectures.
• Package and Mounting — 1152‑FBGA (35×35) FCBGA package, surface mount for space‑efficient board designs.
• Operating Range and Grade — Commercial grade with an ambient operating temperature range of 0 °C to 85 °C.
• Series Documentation — Based on the Arria II GX device family; device datasheet includes detailed electrical characteristics, transceiver performance specifications, I/O timing, and operating conditions.
• Compliance — RoHS‑compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• High‑density digital processing — Implement custom datapaths, signal processing blocks, and control logic using the large pool of logic elements and embedded memory.
• Memory buffering and packet handling — Use the on‑chip RAM for temporary data storage, FIFOs, and packet buffering in communication flow‑control designs.
• Multi‑interface bridging — Leverage 452 I/Os to bridge parallel buses, high‑pin‑count peripherals, and mixed‑signal interfaces within a single FPGA.
• Prototyping to production — Surface‑mount FCBGA packaging and commercial temperature rating suit board‑level prototyping and volume production where commercial grading is required.

Unique Advantages

• Substantial logic and memory integration: Combine approximately 89,178 logic elements with ~6.84 Mbits of embedded RAM to consolidate multiple functions on a single device and reduce component count.
• High I/O density: 452 user I/Os enable flexible connectivity and reduce the need for external I/O expanders or glue logic.
• Compact FCBGA package: 1152‑FBGA (35×35) delivers a high pin count in a compact footprint for board space‑constrained applications.
• Low‑voltage core operation: 0.870–0.930 V core supply supports power‑sensitive system architectures.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronics deployments.
• RoHS compliance: Simplifies lead‑free manufacturing and regulatory alignment.

Why Choose EP2AGX95EF35C6ES?

The EP2AGX95EF35C6ES delivers a balance of high logic density, substantial embedded memory, and extensive I/O in a compact 1152‑FBGA surface‑mount package. Its commercial‑grade temperature range and RoHS compliance make it suitable for production systems requiring consolidated digital functions and flexible interfacing.

This Arria II GX device is well suited for designers who need integrated logic, local RAM, and a large number of user I/Os in one FPGA to streamline board design, reduce BOM complexity, and accelerate time‑to‑market while relying on documented device electrical and transceiver specifications from the Arria II series datasheet.

Request a quote or submit an inquiry to check availability, pricing, and lead times for EP2AGX95EF35C6ES. Our team can provide ordering details and help evaluate this device for your design needs.