EP2AGX95EF35I3

The EP2AGX95EF35I3 is an Intel Arria II GX field-programmable gate array supplied in a high-density 1152-BBGA (1152-FBGA, 35×35) package. The device combines a large logic capacity with substantial embedded memory and a wide I/O complement to support complex, board-level programmable logic designs.

Designed for applications that require significant logic resources, on-chip RAM, and robust environmental performance, this industrial-grade FPGA provides the integration needed for I/O-heavy and compute-intensive designs while operating across an extended temperature range.

Key Features

• Logic Capacity — 89,178 logic elements and 3,747 LABs (logic array blocks) to implement complex state machines, datapaths, and custom accelerators.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• I/O Density — 452 I/O pins to support multichannel connectivity and interface integration on a single device.
• Package and Mounting — 1152-BBGA / 1152-FBGA (35×35) FCBGA package; surface-mount mounting for compact board designs.
• Power Supply — Core supply specified from 0.870 V to 0.930 V, enabling predictable core power planning.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support temperature-demanding environments.
• Standards and Compliance — RoHS compliant.
• Documented Transceiver and I/O Characteristics — Device family documentation includes electrical, I/O timing, and transceiver performance specifications for design validation.

Typical Applications

• Industrial Control — Leverage the industrial temperature rating (−40 °C to 100 °C) and extensive I/O count to interface sensors, actuators, and field I/O in harsh environments.
• High-Density Logic Implementations — Use the 89,178 logic elements and approximately 6.84 Mbits of embedded memory to implement complex control logic, signal processing, or protocol handling on a single device.
• I/O-Intensive Systems — 452 I/Os enable multi-channel data capture, aggregation, or board-level connectivity without adding external multiplexing logic.

Unique Advantages

• Substantial On-Chip Resources: Large logic element count and embedded RAM reduce reliance on external components and simplify system architecture.
• High I/O Integration: 452 I/Os allow direct connections to multiple peripherals and interfaces, lowering BOM complexity.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging applications.
• Compact, High-Pin-Count Package: The 1152-BBGA / 1152-FBGA (35×35) package delivers high density in a surface-mount form factor suitable for space-constrained boards.
• Predictable Power Planning: Defined core voltage range (0.870 V–0.930 V) enables accurate power budgeting for system design.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose EP2AGX95EF35I3?

The EP2AGX95EF35I3 positions itself as a high-capacity Arria II GX FPGA option that balances large logic resources, significant embedded memory, and extensive I/O in a compact FCBGA package. Its industrial-grade temperature rating and documented electrical and transceiver characteristics make it well suited for engineers building robust, I/O-rich systems that require on-device programmable logic and local memory.

For design teams focused on reducing board-level complexity while retaining flexibility, this device delivers integrated resources and predictable power and thermal parameters—facilitating scalable designs and streamlined validation.

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