EP2AGX95EF35C6N

The EP2AGX95EF35C6N is an Arria II GX field programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA surface-mount package. It provides a high-density programmable fabric with embedded memory and a large I/O count for system-level integration in commercial-grade designs.

Built on the Arria II GX device family, this FPGA balances substantial logic resources, on-chip RAM, and extensive I/O while operating within a core voltage range of 0.87–0.93 V and a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity  Approximately 89,178 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
• I/O Count  452 I/O pins to enable broad external interfacing and high pin-count system connectivity.
• Power  Core supply voltage range from 870 mV to 930 mV to match Arria II GX electrical requirements.
• Package & Mounting  1152-BBGA (supplier package: 1152-FBGA 35×35), surface-mount for compact board-level integration.
• Grade & Temperature Range  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance  RoHS compliant.
• Family Documentation  Device handbook and datasheet detail Arria II GX electrical, switching, and transceiver characteristics for system design reference.

Typical Applications

• High-speed communications and networking  Arria II GX device documentation includes transceiver and PCI Express (PIPE) block considerations, supporting implementation of serial links and network interfaces.
• PCI Express-based systems  Designs that require integration with PCI Express PHY/PIPE/links can reference the Arria II GX device family specifications.
• Custom logic and prototyping  Large logic element count and embedded memory make the device suitable for on-board acceleration, protocol offload, and design prototyping.

Unique Advantages

• High logic density: The device’s ~89k logic elements enable substantial on-chip integration, reducing external component count.
• Significant on-chip RAM: Approximately 6.84 Mbits of embedded memory supports buffering and local data processing without immediate dependence on external memory.
• Extensive I/O: 452 I/Os give designers flexibility for peripheral interfacing and multi-channel connectivity.
• Compact, manufacturable package: 1152-BBGA (35×35) FCBGA surface-mount package facilitates dense board-level layouts.
• Commercial temperature & RoHS: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications.
• Family-level design support: Arria II GX device documentation provides electrical, switching, and transceiver specification detail for system validation.

Why Choose EP2AGX95EF35C6N?

EP2AGX95EF35C6N offers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 1152-BBGA surface-mount package. The device is suitable for commercial applications that require significant on-chip resources and board-level integration while operating within defined Arria II GX electrical parameters.

For engineers and procurement teams, this FPGA provides a documented platform from the Arria II GX family with detailed electrical and transceiver characteristics available in the device handbook and datasheet to support design and validation efforts.

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