EP2AGX95EF35I5
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 452 6839296 89178 1152-BBGA, FCBGA |
|---|---|
| Quantity | 583 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 452 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3747 | Number of Logic Elements/Cells | 89178 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6839296 |
Overview of EP2AGX95EF35I5 – Arria II GX Field Programmable Gate Array (FPGA) IC
The EP2AGX95EF35I5 is an Intel Arria II GX field-programmable gate array supplied in a 1152-ball BGA (1152-FBGA, 35×35) package. This industrial-grade FPGA integrates a large programmable fabric with substantial on-chip memory and a high-density I/O complement for complex, system-level digital designs.
Key on-device attributes include 89,178 logic elements, approximately 6.84 Mbits of embedded memory, 452 user I/O pins, and an industrial operating temperature range of −40 °C to 100 °C. The device operates from a core supply in the 870 mV–930 mV range and is RoHS compliant.
Key Features
- Programmable Logic — 89,178 logic elements provide a large, flexible logic fabric for implementing custom digital functions and complex state machines.
- Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, lookup tables, and memory-mapped logic without external memory dependence.
- High-Density I/O — 452 I/O pins support extensive peripheral connectivity and parallel interfaces directly from the FPGA package.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
- Low-Voltage Core — Core supply specified between 870 mV and 930 mV for integration into low-voltage power domains.
- Package — 1152-ball FCBGA (supplier package: 1152-FBGA, 35×35) enables high pin-count routing and compact board-level integration.
- Regulatory Status — RoHS compliant, supporting lead-free and environmentally conscious designs.
Typical Applications
- Custom Digital Processing — Large logic capacity and embedded memory enable implementation of custom accelerators, datapath pipelines, and protocol processing.
- High-Density I/O Systems — 452 user I/Os allow for extensive sensor, peripheral, and parallel interface integration on a single device.
- Industrial Control and Automation — Industrial temperature rating and robust packaging make the device suitable for control systems and factory automation equipment.
Unique Advantages
- Substantial Logic Capacity: 89,178 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing system complexity.
- Embedded Memory Onboard: Approximately 6.84 Mbits of RAM supports local buffering and state storage, lowering reliance on external memory components.
- Extensive I/O Availability: 452 I/Os simplify board-level routing for I/O-heavy designs and reduce the need for external multiplexing.
- Industrial Robustness: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
- Compact, High-Pin-Count Package: 1152-FBGA (35×35) package enables dense system integration while maintaining signal density for complex designs.
- Low-Voltage Core Operation: 870 mV–930 mV core supply range aligns with modern low-voltage power architectures.
Why Choose EP2AGX95EF35I5?
The EP2AGX95EF35I5 Arria II GX FPGA balances large programmable logic capacity, significant embedded memory, and a high I/O count in a compact 1152-ball BGA package designed for industrial environments. Its specification set makes it a practical choice for engineers consolidating multiple digital functions, implementing hardware accelerators, or building I/O-rich systems that must operate across wide temperature ranges.
With RoHS compliance and clearly defined electrical and environmental limits, this device is positioned for designs that require traceable, verifiable on-board resources and predictable integration into low-voltage, industrial applications.
If you would like pricing, lead-time, or availability, request a quote or submit an inquiry to receive further purchasing and technical details.

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