EP2AGX95EF35I5

IC FPGA 452 I/O 1152FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 452 6839296 89178 1152-BBGA, FCBGA

Quantity 583 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O452Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3747Number of Logic Elements/Cells89178
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95EF35I5 – Arria II GX Field Programmable Gate Array (FPGA) IC

The EP2AGX95EF35I5 is an Intel Arria II GX field-programmable gate array supplied in a 1152-ball BGA (1152-FBGA, 35×35) package. This industrial-grade FPGA integrates a large programmable fabric with substantial on-chip memory and a high-density I/O complement for complex, system-level digital designs.

Key on-device attributes include 89,178 logic elements, approximately 6.84 Mbits of embedded memory, 452 user I/O pins, and an industrial operating temperature range of −40 °C to 100 °C. The device operates from a core supply in the 870 mV–930 mV range and is RoHS compliant.

Key Features

  • Programmable Logic — 89,178 logic elements provide a large, flexible logic fabric for implementing custom digital functions and complex state machines.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, lookup tables, and memory-mapped logic without external memory dependence.
  • High-Density I/O — 452 I/O pins support extensive peripheral connectivity and parallel interfaces directly from the FPGA package.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
  • Low-Voltage Core — Core supply specified between 870 mV and 930 mV for integration into low-voltage power domains.
  • Package — 1152-ball FCBGA (supplier package: 1152-FBGA, 35×35) enables high pin-count routing and compact board-level integration.
  • Regulatory Status — RoHS compliant, supporting lead-free and environmentally conscious designs.

Typical Applications

  • Custom Digital Processing — Large logic capacity and embedded memory enable implementation of custom accelerators, datapath pipelines, and protocol processing.
  • High-Density I/O Systems — 452 user I/Os allow for extensive sensor, peripheral, and parallel interface integration on a single device.
  • Industrial Control and Automation — Industrial temperature rating and robust packaging make the device suitable for control systems and factory automation equipment.

Unique Advantages

  • Substantial Logic Capacity: 89,178 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing system complexity.
  • Embedded Memory Onboard: Approximately 6.84 Mbits of RAM supports local buffering and state storage, lowering reliance on external memory components.
  • Extensive I/O Availability: 452 I/Os simplify board-level routing for I/O-heavy designs and reduce the need for external multiplexing.
  • Industrial Robustness: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
  • Compact, High-Pin-Count Package: 1152-FBGA (35×35) package enables dense system integration while maintaining signal density for complex designs.
  • Low-Voltage Core Operation: 870 mV–930 mV core supply range aligns with modern low-voltage power architectures.

Why Choose EP2AGX95EF35I5?

The EP2AGX95EF35I5 Arria II GX FPGA balances large programmable logic capacity, significant embedded memory, and a high I/O count in a compact 1152-ball BGA package designed for industrial environments. Its specification set makes it a practical choice for engineers consolidating multiple digital functions, implementing hardware accelerators, or building I/O-rich systems that must operate across wide temperature ranges.

With RoHS compliance and clearly defined electrical and environmental limits, this device is positioned for designs that require traceable, verifiable on-board resources and predictable integration into low-voltage, industrial applications.

If you would like pricing, lead-time, or availability, request a quote or submit an inquiry to receive further purchasing and technical details.

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