EP2AGZ225FF35C3G

The EP2AGZ225FF35C3G is an Intel Field Programmable Gate Array (FPGA) IC delivering high logic capacity and substantial on-chip memory in a compact ball-grid package. This device integrates 224,000 logic elements, approximately 14.25 Mbits of embedded RAM, and 554 I/O pins to support complex digital designs that require dense logic, memory and interface resources.

Packaged in a 1152-ball FBGA (35×35) surface-mount format and operating from a 870 mV to 930 mV supply, the part is intended for commercial-temperature embedded applications that benefit from high logic density and abundant I/O connectivity.

Key Features

• Core Logic 224,000 logic elements to implement large combinational and sequential logic networks.
• Embedded Memory Approximately 14.25 Mbits of on-chip RAM to support frame buffers, FIFOs, and local data storage without external memory.
• I/O Capacity 554 I/O pins for extensive peripheral, sensor, and interface connectivity across multiple domains.
• Package & Mounting 1152-FBGA (35×35) / 1152-BBGA FCBGA in a surface-mount package for dense PCB integration.
• Power Device core supply specified at 870 mV to 930 mV, allowing designers to plan power delivery and sequencing precisely.
• Operating Range Commercial grade operation from 0°C to 85°C to match standard embedded and consumer electronics environments.
• Compliance RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing — Implements complex custom logic and datapath functions where large numbers of logic elements are required.
• Memory-intensive functions — Uses the device’s approximately 14.25 Mbits of embedded RAM for buffering, packet queues, or local storage to reduce external memory dependency.
• Multi-interface bridging — Leverages 554 I/Os to consolidate multiple peripheral interfaces, sensors, and high-pin-count connectors on a single FPGA.
• Embedded system prototyping — Provides a high-resource platform for validating complex designs that need both dense logic and significant on-chip memory.

Unique Advantages

• High logic density: 224,000 logic elements support large-scale custom logic implementations without immediate migration to larger devices.
• Substantial on-chip memory: Approximately 14.25 Mbits of embedded RAM reduce reliance on external memory components and simplify board designs.
• Extensive I/O: 554 I/O pins enable broad connectivity, reducing the need for external multiplexers or expanders.
• Compact, surface-mount package: 1152-FBGA (35×35) allows high-resource FPGA functionality in a PCB-friendly form factor.
• Predictable power envelope: Core supply range of 870 mV to 930 mV supports precise power planning and energy profiling.
• RoHS compliant: Meets common environmental and manufacturing standards for lead-free assemblies.

Why Choose EP2AGZ225FF35C3G?

The EP2AGZ225FF35C3G offers a combination of high logic element count, significant embedded memory, and large I/O capacity in a single commercial-grade, surface-mount FBGA package. It is suitable for designs that require dense programmable logic and substantial on-chip RAM while maintaining a compact PCB footprint.

As an Intel FPGA, this device is positioned for engineers and procurement teams seeking a proven programmable-platform option for complex embedded and interface-heavy applications, providing predictable electrical and thermal parameters for system-level design.

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