EP2AGZ225FF35C4N

The EP2AGZ225FF35C4N is an Arria II GZ family field programmable gate array (FPGA) IC from Intel. It delivers high-density programmable logic and on-chip memory capacity in a compact 1152-ball FCBGA package for surface-mount assembly.

This device is suited for designs that require extensive logic resources and high I/O integration, providing up to 224,000 logic elements, approximately 14.25 Mbits of embedded RAM, and 554 I/O pins. Comprehensive electrical and switching characteristics for the Arria II family, including transceiver performance, are documented in the device handbook.

Key Features

• High-density programmable logic  Provides 224,000 logic elements to implement complex custom logic and parallel processing architectures.
• Embedded memory  Approximately 14.25 Mbits of on-chip RAM to support buffering, packet processing, and state storage without external memory for many use cases.
• Extensive I/O  554 I/O pins to support wide parallel interfaces, multiple peripherals, or extensive board-level connectivity.
• Core voltage  Core supply range specified from 870 mV to 930 mV for the programmable logic core.
• Package and mounting  1152-ball FCBGA (35×35 mm) package designed for surface-mount assembly to minimize board footprint while maximizing I/O density.
• Commercial grade and temperature  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Standards and compliance  RoHS compliant.
• Documentation  Detailed Arria II device handbook entries cover electrical characteristics and transceiver performance for informed design and system integration.

Typical Applications

• High-density digital processing  Use the device’s 224,000 logic elements and embedded RAM to implement complex datapaths, custom accelerators, and parallel processing blocks.
• Interface aggregation  Leverage 554 I/O pins to aggregate multiple high-pin-count interfaces and bridge heterogeneous peripheral sets on a single FPGA.
• Prototyping and system integration  Surface-mount FCBGA package and broad I/O support make the device suited for system-level prototypes and high-integration board designs.

Unique Advantages

• Large logic resource pool: 224,000 logic elements allow designers to implement large-scale custom logic without immediate partitioning across multiple devices.
• On-chip memory density: Approximately 14.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs, simplifying BOM and board routing.
• High I/O capacity: 554 I/O pins provide flexibility to connect to numerous peripherals, wide buses, or parallel interfaces directly to the FPGA.
• Compact high-density package: 1152-ball FCBGA (35×35) minimizes board area while delivering high I/O count and thermal handling consistent with surface-mount designs.
• Low-voltage core operation: Core supply range of 870–930 mV supports modern low-voltage FPGA core domains and power planning.
• Documented electrical and transceiver data: The Arria II device handbook provides detailed electrical characteristics and transceiver performance to support reliable system integration and validation.

Why Choose EP2AGZ225FF35C4N?

The EP2AGZ225FF35C4N positions itself as a high-density, commercially graded Arria II GZ FPGA that balances significant logic capacity, substantial on-chip RAM, and broad I/O connectivity in a compact FCBGA package. Its documented electrical characteristics and transceiver information support engineering evaluation and system-level integration.

This device is well suited to teams and projects that need scalable programmable logic resources with strong on-chip memory and I/O integration, supported by Intel’s Arria II device documentation for design and validation activities.

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