EP2AGZ225FF35I4G

The EP2AGZ225FF35I4G is an Intel Arria II family FPGA offering a high-density, low-power 40‑nm programmable logic engine. It delivers 224,000 logic elements, approximately 14.25 Mbits of embedded memory, and extensive I/O capability for industrial embedded and communications applications.

Engineered for systems that require scalable logic, on-chip memory, and high-speed serial interfaces, this industrial‑grade device supports a wide range of high-bandwidth interfaces and on-chip security/configuration options to streamline system integration.

Key Features

• Core Architecture  40‑nm Arria II programmable logic engine with adaptive logic modules (ALMs) and eight‑input fracturable LUTs for flexible logic implementation.
• Logic Density  224,000 logic elements to implement complex control, processing, and glue-logic functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM for FIFOs, buffers, and data storage.
• High‑Performance DSP  Integrated DSP blocks supporting designs up to 550 MHz for signal processing and arithmetic-intensive tasks.
• Transceivers & I/O  Support for up to 24 full-duplex CDR-based transceivers (600 Mbps to 6.375 Gbps) and 554 user I/O pins for high-bandwidth serial and parallel interfaces.
• Interfaces & Protocols  Built-in support and dedicated circuitry for common serial protocols and physical layers including PCIe, Ethernet, DDR3 memory interfaces, SATA, and other high-speed links described for the Arria II family.
• Security & Configuration  256‑bit AES programming file encryption and parallel/serial configuration options to protect design IP and support secure provisioning.
• Package & Mounting  1152‑BBGA / 1152‑FBGA FCBGA package (35 × 35 mm), surface-mount mounting for compact board integration.
• Power & Supply  Operating core supply range documented at 870 mV to 930 mV to match system power delivery design choices.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for industrial applications.
• Standards & Compliance  RoHS compliant.

Typical Applications

• High‑speed networking and communications  Implements transceiver-based interfaces (600 Mbps–6.375 Gbps) and physical-layer logic for Ethernet, PCIe, and other serial protocols.
• Embedded signal processing  Uses the DSP blocks and abundant logic elements for video, radio, and real-time DSP workloads.
• Memory and interface bridging  Acts as a protocol bridge or controller for DDR3 memory and high-bandwidth peripheral interfaces leveraging on-chip RAM and I/O resources.
• Industrial control and automation  Provides robust logic capacity and an industrial temperature rating for motor control, sensor aggregation, and deterministic control systems.

Unique Advantages

• High logic capacity: 224,000 logic elements enable complex multi-function designs without immediate need to partition across multiple devices.
• Substantial embedded memory: Approximately 14.25 Mbits of on-chip RAM reduces external memory dependency for buffers and FIFOs.
• Wide I/O and high-speed links: 554 user I/Os plus up to 24 high-speed transceivers simplify system-level connectivity for demanding interfaces.
• Industrial robustness: −40 °C to 100 °C rating and surface-mount FCBGA packaging support deployment in industrial environments.
• Integrated security and configuration: 256‑bit AES encryption and flexible configuration options protect IP and support secure device provisioning.
• Proven family features: Arria II family capabilities such as ALMs, fracturable LUTs, and optimized DSP resources provide predictable integration into existing design flows.

Why Choose EP2AGZ225FF35I4G?

The EP2AGZ225FF35I4G combines a high-density Arria II logic fabric with substantial on-chip memory, robust DSP resources, and flexible, high-speed I/O — all in an industrial‑rated package. It is well suited for designers who need a compact, high-performance FPGA platform for communications, embedded processing, and industrial control systems.

Choosing this device provides a balance of integration, scalability, and security capabilities that streamline board-level design while supporting demanding interface and processing requirements over a wide operating temperature range.

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