EP2AGZ225HF40C3N

The EP2AGZ225HF40C3N is an Arria II GZ Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA surface-mount package. It delivers high logic capacity and extensive I/O in a commercial-grade device intended for high-density programmable logic integration.

Key on-chip resources include 224,000 logic elements and approximately 14.25 Mbits of embedded memory, with 734 user I/Os and a core supply voltage range of 870 mV to 930 mV. The device is RoHS compliant and rated for commercial operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  224,000 logic elements suitable for complex, high-density digital designs.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
• I/O Density  734 user I/O pins to accommodate extensive peripheral, bus, and parallel interfacing requirements.
• Package and Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply specified from 870 mV to 930 mV to match system power-rail requirements.
• Operating Grade & Temperature  Commercial grade, specified for operation from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for environmental and manufacturing compliance.
• Family  Part of the Arria II device family (GZ devices), with device-level electrical characteristics documented in the Arria II device handbook.

Typical Applications

• High-density programmable logic systems  Use the EP2AGZ225HF40C3N where large counts of logic elements and on-chip memory are required to implement complex digital functions.
• Designs needing extensive I/O  Leverage 734 I/Os for interfacing multiple peripherals, buses, or parallel data paths on compact PCBs.
• Embedded processing and buffering  Approximately 14.25 Mbits of embedded memory support local data storage and buffering within the FPGA fabric.

Unique Advantages

• High logic density: 224,000 logic elements provide the fabric to implement large-scale digital designs without additional external logic.
• Substantial embedded memory: Approximately 14.25 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage tasks.
• Extensive I/O count: 734 user I/Os enable broad connectivity options for complex systems and high-channel-count applications.
• Compact, manufacturable package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports dense PCB layouts and modern assembly processes.
• Controlled core power range: 870 mV–930 mV core supply specification supports predictable power integration in system power budgets.
• Commercial temperature and RoHS compliance: Rated 0 °C–85 °C and RoHS compliant for mainstream commercial product deployments.

Why Choose EP2AGZ225HF40C3N?

The EP2AGZ225HF40C3N combines high logic element count, substantial embedded RAM, and a very large I/O complement in a compact FCBGA package, making it well suited for commercial designs that require dense programmable logic and broad interfacing capabilities. As a member of the Arria II GZ family, its device-level electrical characteristics and performance envelopes are documented for design integration and validation.

Choose this device when your design demands significant on-chip resources and a high I/O count in a surface-mount, RoHS-compliant commercial-grade FPGA package.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP2AGZ225HF40C3N.