EP2AGZ225HF40C4G

The EP2AGZ225HF40C4G is a commercial-grade Field Programmable Gate Array (FPGA) IC from Intel, delivered in a high-density FCBGA package for surface-mount assembly. It combines a large programmable fabric, substantial on-chip memory, and a high I/O count to support complex, logic‑intensive designs.

Designed for applications that require significant logic capacity, abundant embedded memory, and extensive external connectivity, this device targets commercial systems where integration and flexibility matter. Key attributes include 224,000 logic elements, approximately 14.25 Mbits of embedded memory, and 734 I/O pins.

Key Features

• Programmable Logic Capacity — 224,000 logic elements provide a broad fabric for implementing custom digital logic, state machines, and data-paths.
• Embedded Memory — Approximately 14.25 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for accelerated processing.
• I/O Resources — 734 user I/O pins to accommodate wide parallel buses, multiple interfaces, and flexible board-level connectivity.
• Power Supply — Supports a core voltage range of 870 mV to 930 mV, enabling compatibility with systems designed around low-voltage FPGA cores.
• Package and Mounting — Available in a 1517-ball FCBGA (1517-FBGA, 40×40) package with surface-mount mounting for compact PCB layouts and reliable solder reflow assembly.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C suitable for standard commercial environments.
• Standards Compliance — RoHS compliant for conformity with lead-free manufacturing requirements.

Typical Applications

• High-density I/O systems — Use the 734 I/O pins for designs that require extensive peripheral connections, parallel interfaces, or multi-channel data acquisition.
• Embedded processing and acceleration — Leverage 224,000 logic elements and approximately 14.25 Mbits of embedded memory to implement custom accelerators, protocol offloads, or DSP blocks.
• Prototyping and complex logic integration — Suitable for development platforms and commercial prototypes that need significant programmable logic and memory on a single device.

Unique Advantages

• Large programmable fabric: 224,000 logic elements enable complex logic implementations and broad functional integration on one device, reducing board-level component count.
• Substantial on-chip memory: Approximately 14.25 Mbits of embedded RAM helps minimize external memory dependency and improves data-path performance.
• Extensive connectivity: 734 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and high-throughput buses without external multiplexing.
• Compact FCBGA package: The 1517-FBGA (40×40) package supports dense PCB layouts and reliable surface-mount assembly for space-constrained commercial designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments where consistent operation in that range is required.
• RoHS compliance: Designed for lead-free manufacturing processes, simplifying regulatory and supply-chain considerations.

Why Choose EP2AGZ225HF40C4G?

The EP2AGZ225HF40C4G provides a balanced combination of logic density, embedded memory, and high I/O count in a compact FCBGA package, making it well suited for commercial systems that require significant programmable integration. Its power and temperature specifications align with typical commercial designs, and RoHS compliance supports lead-free production workflows.

This device is ideal for design teams building feature-rich, logic-intensive applications—whether integrating custom accelerators, managing large I/O matrices, or consolidating multiple functions into a single FPGA. The combination of resources supports scalability and long-term design flexibility within commercial deployment profiles.

Request a quote or submit an inquiry for the EP2AGZ225HF40C4G to evaluate availability and pricing for your next design.