EP2AGZ225HF40I4N

The EP2AGZ225HF40I4N is an Arria II GZ family FPGA in a high-density FCBGA package, manufactured by Intel. It delivers a large logic fabric and embedded memory for complex custom digital designs and industrial applications.

Device-level characteristics and operating conditions for the Arria II family are documented in the device datasheet, which covers electrical and switching characteristics, I/O timing, and transceiver and core/periphery performance. This particular device is offered in an industrial grade and supports broad operating conditions suitable for demanding environments.

Key Features

• Logic Capacity  Approximately 224,000 logic elements to implement large, deeply pipelined or parallel digital circuits.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density  Up to 734 I/O pins for wide external interfacing and high pin-count designs.
• Core Voltage  Core supply range specified at 870 mV to 930 mV for device power domains.
• Package  1517-BBGA FCBGA package (supplier device package listed as 1517-FBGA (40×40)) for compact, high-pin-count surface-mount integration.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C for deployments in challenging thermal environments.
• Mounting & Compliance  Surface-mount device with RoHS compliance.

Typical Applications

• Industrial Control  Industrial-grade temperature rating and high logic capacity enable control systems and automation equipment requiring reliable operation across wide temperature ranges.
• Embedded Processing  Large logic resources and embedded RAM support custom compute blocks, data path acceleration, and protocol handling in embedded systems.
• High-Density I/O Systems  The device’s 734 I/O capability suits designs that need extensive external interfaces or multiple parallel data streams.
• Prototyping and System Integration  A high-density Arria II GZ FPGA in an FCBGA package allows integration of complex digital subsystems during development and system-level prototyping.

Unique Advantages

• Substantial Logic Resources:  224,000 logic elements provide capacity for large-scale RTL implementations without partitioning across multiple devices.
• Significant On-Chip Memory:  Approximately 14.25 Mbits of embedded memory reduces reliance on external RAM for many buffering and state-storage needs.
• High I/O Count:  Up to 734 I/O pins offer flexibility for dense connectivity and multi-channel interfacing.
• Industrial-Rated Operation:  Specified operating range from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact High-Pin Package:  1517-BBGA FCBGA packaging provides a compact solution for high-pin-count BOM-constrained designs.
• Standards Compliance:  RoHS-compliant construction for regulatory and environmental compatibility.

Why Choose EP2AGZ225HF40I4N?

The EP2AGZ225HF40I4N positions itself as a high-capacity Arria II GZ FPGA option for engineers who require substantial logic resources, significant on-chip memory, and broad I/O in an industrial-grade device. Its specified core voltage range and documented device-level electrical and switching characteristics make it suitable for designs that demand predictable operating conditions and integration into complex digital systems.

This device is appropriate for teams building large custom digital blocks, high-density I/O systems, and industrial embedded platforms that benefit from a mature FPGA family with comprehensive device documentation.

If you would like pricing or availability information, request a quote or submit a purchase inquiry to our sales team referencing part number EP2AGZ225HF40I4N.