EP2AGZ300FF35C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 273 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 554 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11920 | Number of Logic Elements/Cells | 298000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 18854912 |
Overview of EP2AGZ300FF35C3G – Field Programmable Gate Array (FPGA) IC
The EP2AGZ300FF35C3G is a commercial-grade Arria II family FPGA from Intel, featuring a 40-nm low-power programmable logic engine. This device targets designs that require high logic density, substantial embedded memory, and a broad set of high-speed interfaces for data and system integration.
With 298,000 logic elements, approximately 18.85 Mbits of on-chip RAM, and 554 I/O pins in a high-pin-count FCBGA package, the device is suited for applications that demand complex logic, extensive buffering, and multiple external interfaces while operating within a 0 °C to 85 °C commercial temperature range.
Key Features
- Core Architecture 40-nm, low-power FPGA engine from the Arria II family with adaptive logic modules (ALMs) and eight-input fracturable LUTs for efficient logic implementation.
- Logic Density 298,000 logic elements to implement large-scale combinational and sequential logic functions.
- Embedded Memory Approximately 18.85 Mbits of on-chip RAM for buffering, FIFOs, and storage of intermediate data.
- I/O and Transceivers 554 I/Os and family-level support for up to 24 full-duplex CDR-based transceivers with data-rate capability described in the Arria II device handbook.
- High-Speed Protocol Support (Family-Level) Arria II family features that support physical-layer functionality for interfaces such as PCIe, Ethernet, DDR3, and multiple serial protocols as documented in the device handbook.
- Power and Voltage Core voltage supply range specified at 870 mV to 930 mV to match system power planning and regulator selection.
- Package and Mounting 1152-FBGA (35 × 35 mm) FCBGA package, surface-mountable for high-density board integration.
- Operating Conditions and Compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant material status.
Typical Applications
- High-speed networking equipment — Implements packet processing, interface bridging, and protocol offload using abundant logic, embedded memory, and high-speed transceivers.
- Communications infrastructure — Acts as a programmable hub for protocol adaptation, SERDES-based links, and custom data-paths in baseband or transport systems.
- Embedded compute and acceleration — Provides logic and DSP fabric for hardware acceleration, buffering, and custom state machines in compute-rich modules.
- Prototyping and system integration — Useful for validating complex digital designs and integrating multiple I/O standards on a single FPGA platform.
Unique Advantages
- High logic capacity: 298,000 logic elements support large-scale designs and complex state machines without immediate need for multiple devices.
- Significant on-chip memory: Approximately 18.85 Mbits of embedded RAM reduces external memory dependency for many buffering and FIFO use cases.
- Abundant I/O: 554 I/Os in a 1152-FBGA package enable dense external connectivity and multiple banked I/O interfaces on a single device.
- Family-level high-speed interface support: Arria II device features include transceiver and protocol support that ease integration of PCIe, Ethernet, DDR3, and other serial links.
- Commercial-grade packaging and compliance: Surface-mount FCBGA package with RoHS compliance for standard-volume, commercial applications.
- Tightly specified core power: Defined 870 mV–930 mV supply range simplifies power-supply design and thermal budgeting.
Why Choose EP2AGZ300FF35C3G?
The EP2AGZ300FF35C3G positions itself as a high-density, commercially graded Arria II FPGA for designs that require substantial logic resources, embedded memory, and extensive I/O in a single-package solution. Its family-level feature set supports modern serial and parallel interfaces, enabling integration of complex data-paths and protocol logic.
This device is well suited to engineers and system integrators building high-performance networking, communication, and embedded acceleration modules who need a balance of logic capacity, on-chip RAM, and high-pin-count packaging with clear electrical and thermal parameters.
Request a quote or submit an inquiry to receive pricing and availability information for EP2AGZ300FF35C3G and to discuss volume or project-specific needs.

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