EP2AGZ300FF35C3G

IC FPGA 554 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 273 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O554Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11920Number of Logic Elements/Cells298000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18854912

Overview of EP2AGZ300FF35C3G – Field Programmable Gate Array (FPGA) IC

The EP2AGZ300FF35C3G is a commercial-grade Arria II family FPGA from Intel, featuring a 40-nm low-power programmable logic engine. This device targets designs that require high logic density, substantial embedded memory, and a broad set of high-speed interfaces for data and system integration.

With 298,000 logic elements, approximately 18.85 Mbits of on-chip RAM, and 554 I/O pins in a high-pin-count FCBGA package, the device is suited for applications that demand complex logic, extensive buffering, and multiple external interfaces while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Architecture 40-nm, low-power FPGA engine from the Arria II family with adaptive logic modules (ALMs) and eight-input fracturable LUTs for efficient logic implementation.
  • Logic Density 298,000 logic elements to implement large-scale combinational and sequential logic functions.
  • Embedded Memory Approximately 18.85 Mbits of on-chip RAM for buffering, FIFOs, and storage of intermediate data.
  • I/O and Transceivers 554 I/Os and family-level support for up to 24 full-duplex CDR-based transceivers with data-rate capability described in the Arria II device handbook.
  • High-Speed Protocol Support (Family-Level) Arria II family features that support physical-layer functionality for interfaces such as PCIe, Ethernet, DDR3, and multiple serial protocols as documented in the device handbook.
  • Power and Voltage Core voltage supply range specified at 870 mV to 930 mV to match system power planning and regulator selection.
  • Package and Mounting 1152-FBGA (35 × 35 mm) FCBGA package, surface-mountable for high-density board integration.
  • Operating Conditions and Compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant material status.

Typical Applications

  • High-speed networking equipment — Implements packet processing, interface bridging, and protocol offload using abundant logic, embedded memory, and high-speed transceivers.
  • Communications infrastructure — Acts as a programmable hub for protocol adaptation, SERDES-based links, and custom data-paths in baseband or transport systems.
  • Embedded compute and acceleration — Provides logic and DSP fabric for hardware acceleration, buffering, and custom state machines in compute-rich modules.
  • Prototyping and system integration — Useful for validating complex digital designs and integrating multiple I/O standards on a single FPGA platform.

Unique Advantages

  • High logic capacity: 298,000 logic elements support large-scale designs and complex state machines without immediate need for multiple devices.
  • Significant on-chip memory: Approximately 18.85 Mbits of embedded RAM reduces external memory dependency for many buffering and FIFO use cases.
  • Abundant I/O: 554 I/Os in a 1152-FBGA package enable dense external connectivity and multiple banked I/O interfaces on a single device.
  • Family-level high-speed interface support: Arria II device features include transceiver and protocol support that ease integration of PCIe, Ethernet, DDR3, and other serial links.
  • Commercial-grade packaging and compliance: Surface-mount FCBGA package with RoHS compliance for standard-volume, commercial applications.
  • Tightly specified core power: Defined 870 mV–930 mV supply range simplifies power-supply design and thermal budgeting.

Why Choose EP2AGZ300FF35C3G?

The EP2AGZ300FF35C3G positions itself as a high-density, commercially graded Arria II FPGA for designs that require substantial logic resources, embedded memory, and extensive I/O in a single-package solution. Its family-level feature set supports modern serial and parallel interfaces, enabling integration of complex data-paths and protocol logic.

This device is well suited to engineers and system integrators building high-performance networking, communication, and embedded acceleration modules who need a balance of logic capacity, on-chip RAM, and high-pin-count packaging with clear electrical and thermal parameters.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGZ300FF35C3G and to discuss volume or project-specific needs.

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