EP2AGZ300FF35I3G

EP2AGZ300FF35I3G is a Field Programmable Gate Array (FPGA) IC from Intel. It provides high-density programmable logic, substantial on-chip memory, and a large I/O complement in a compact FCBGA package.

Targeted for industrial applications, the device offers 298,000 logic elements, approximately 18.85 Mbits of embedded memory, 554 I/O pins, an operating temperature range of −40°C to 100°C, and a nominal supply range of 870 mV to 930 mV.

Key Features

• Core Logic 298,000 logic elements for complex, high-density digital designs.
• Embedded Memory Approximately 18.85 Mbits of on-chip RAM providing local data storage and buffering.
• I/O Capacity 554 I/O pins to support extensive external interfacing and signal routing.
• Package & Mounting 1152-FBGA (35×35) FCBGA package with surface-mount mounting for compact board integration.
• Power Voltage supply range from 870 mV to 930 mV for low-voltage system designs.
• Temperature Range Industrial operating range from −40°C to 100°C for deployment in demanding environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control and Automation Leverages the industrial temperature rating and high logic and I/O capacity for control, monitoring, and I/O aggregation tasks.
• High-density Logic Consolidation Uses the large logic element count and on-chip memory to combine multiple digital functions into a single device footprint.
• High I/O Interface Systems Employs 554 I/O pins for systems requiring numerous external interfaces and signal routing.

Unique Advantages

• High Logic Capacity: 298,000 logic elements enable consolidation of complex functions and reduce board-level component count.
• Substantial On-chip Memory: Approximately 18.85 Mbits of embedded RAM lowers reliance on external memory components.
• Extensive Connectivity: 554 I/O pins provide flexibility for multiple peripherals, sensors, and interface standards.
• Industrial Temperature Support: Rated from −40°C to 100°C for reliable operation in temperature-critical environments.
• Compact Surface-mount Packaging: 1152-FBGA (35×35) package balances high pin count with board-space efficiency.
• RoHS Compliant: Meets RoHS environmental requirements.

Why Choose EP2AGZ300FF35I3G?

EP2AGZ300FF35I3G combines high logic density, significant embedded memory, and extensive I/O in a compact 1152-FBGA package, making it well suited for industrial applications that require dense programmable logic and broad connectivity. Its operating voltage range of 870 mV to 930 mV and industrial temperature rating support robust deployments in temperature-sensitive environments.

Engineers and system designers seeking a single-device solution for integrating multiple digital functions will find the specification mix advantageous for scalable, long-term designs where on-chip resources and high I/O count reduce BOM complexity.

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