EP2AGZ300FF35I3N

The EP2AGZ300FF35I3N is an Arria II GZ family FPGA from Intel, delivering high-density, reconfigurable logic in a compact FCBGA package. It combines a large logic element count, substantial on-chip memory, and extensive I/O for industrial-grade embedded and system designs.

This device is targeted at applications that require significant programmable logic capacity, plentiful embedded RAM, and a high number of I/O signals within a surface-mount 1152-BBGA (35 × 35) footprint.

Key Features

• Logic Capacity  Approximately 298,000 logic elements to implement complex digital logic, control, and state machines.
• Embedded Memory  Approximately 18.85 Mbits of on-chip RAM for buffering, LUT-based storage, and small-data structures.
• I/O Density  554 user I/Os to support broad peripheral and bus connectivity without extensive external multiplexing.
• Package & Mounting  1152-BBGA / 1152-FBGA (35 × 35) FCBGA package; surface-mount mounting type for compact board-level integration.
• Power Supply  Core supply range of 870 mV to 930 mV to match controlled-power system designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Manufacturer  Intel Arria II GZ device family.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Leverage industrial temperature rating and high logic density to implement control algorithms, protocol bridging, and deterministic I/O handling.
• Embedded Systems  Combine large on-chip RAM and extensive I/O to consolidate peripherals and accelerate custom logic functions in embedded platforms.
• High-Density Logic Integration  Use the substantial logic element count to integrate multiple digital functions into a single FPGA, reducing board-level complexity.

Unique Advantages

• High integration in a compact package: 1152-ball FCBGA (35 × 35) enables dense placement of a large FPGA core on space-constrained PCBs.
• Significant on-chip memory: Approximately 18.85 Mbits of embedded RAM reduces dependence on external memory for many buffering and state needs.
• Extensive I/O resources: 554 I/Os simplify connectivity to peripherals, sensors, and buses without added components.
• Designed for industrial environments: −40 °C to 100 °C operating range supports a wide set of industrial deployments.
• Predictable core supply window: 0.87–0.93 V core voltage range supports controlled-power design and power budgeting.
• RoHS compliant: Aligns with environmental restriction requirements for electronic assemblies.

Why Choose EP2AGZ300FF35I3N?

The EP2AGZ300FF35I3N positions itself as a high-density, industrial-grade FPGA option within the Arria II GZ family, offering a combination of nearly 298,000 logic elements, substantial embedded memory, and a large I/O complement in a compact FCBGA package. These attributes make it well suited for designers consolidating multiple digital functions on a single device while maintaining industrial operating margins.

Manufactured by Intel and documented within the Arria II device handbook, the part is appropriate for teams needing a scalable programmable-logic building block for industrial embedded systems and high-density logic implementations.

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