EP2AGZ300FH29C3G

The EP2AGZ300FH29C3G is a commercial-grade Field Programmable Gate Array (FPGA) from Intel, designed for applications that require high logic density and substantial on-chip memory. It combines a large number of logic elements with abundant embedded RAM and a sizeable I/O complement to support complex custom logic implementations and system-level integration.

Key Features

• Core Logic 298,000 logic elements to implement high-density combinational and sequential logic designs.
• Embedded Memory Approximately 18.85 Mbits of on-chip RAM, enabling large buffers, FIFOs, and memory-mapped structures without external memory.
• I/O Capability 281 user I/O pins to support broad peripheral and interface connectivity directly from the device package.
• Power Operates from a supply range of 870 mV to 930 mV, allowing design planning around a defined core voltage window.
• Package Surface-mount FCBGA package supplied in a 780-ball HBGA format (33 × 33), providing a compact, soldered solution for PCB assembly.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C suitable for standard environment embedded applications.
• Regulatory RoHS compliant, meeting common material restriction requirements for electronic assembly.

Typical Applications

• Custom hardware acceleration — Use the 298,000 logic elements and embedded memory to implement application-specific accelerators and data-path engines.
• Signal processing and buffering — Approximately 18.85 Mbits of on-chip RAM supports large buffers, FIFOs, and streaming data-handling functions.
• System glue and interface bridging — 281 I/O pins enable dense peripheral interfacing and protocol conversion within tight PCB footprints.

Unique Advantages

• High logic density: 298,000 logic elements provide capacity for complex RTL designs without immediate need for multiple devices.
• Significant on-chip memory: Approximately 18.85 Mbits of embedded RAM reduces dependence on external memory, simplifying board-level design.
• Generous I/O count: 281 user I/Os support diverse connectivity and reduce the need for external multiplexing or expansion components.
• Compact BGA package: 780-ball FCBGA (33 × 33) enables a high-pin-count solution while conserving PCB area through surface-mount assembly.
• Commercial-grade reliability: Specified operation from 0 °C to 85 °C and RoHS compliance align with standard embedded and electronic product requirements.

Why Choose EP2AGZ300FH29C3G?

The EP2AGZ300FH29C3G positions itself as a high-capacity, commercial-grade FPGA that balances large programmable logic resources with substantial embedded memory and a broad I/O complement. It is well suited to designers needing to consolidate complex logic, buffering, and interfacing into a single programmable device while maintaining a compact board footprint.

Backed by Intel’s FPGA product lineage and documented specifications, this device is appropriate for teams developing custom accelerators, signal-processing blocks, and dense I/O subsystems that benefit from on-chip memory and high logic density. The combination of package, voltage range, and operational temperature supports robust implementation in standard embedded product environments.

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