EP2AGZ300FH29C4G

The EP2AGZ300FH29C4G is a commercial-grade Field Programmable Gate Array (FPGA) IC manufactured by Intel. It provides a high level of on-chip logic capacity, embedded memory, and I/O count in a compact FCBGA package for programmable digital designs.

Designed for commercial applications, this device combines extensive logic resources with substantial embedded RAM and a broad I/O complement, enabling integration of configurable digital functions within a single surface-mount package.

Key Features

• Logic Capacity  Approximately 298,000 logic elements across 11,920 logic array blocks, delivering substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 18.85 Mbits of on-chip RAM, suitable for buffering, FIFOs, and lookup table storage within the FPGA fabric.
• I/O Count  281 general-purpose I/O pins to support multiple external interfaces and peripherals.
• Package  780-ball BGA (FCBGA) / supplier device package 780-HBGA (33×33) in a surface-mount footprint for dense board-level integration.
• Power  Rated operating supply range from 870 mV to 930 mV to meet on-chip core voltage requirements.
• Temperature and Grade  Commercial grade with an operating temperature range of 0°C to 85°C.
• Compliance  RoHS compliant, supporting lead-free assembly and regulatory preferences.

Typical Applications

• Commercial embedded systems  Programmable logic for configurable control, data processing, and interface management in commercial products.
• High-density I/O designs  Systems requiring many external connections can leverage the device’s 281 I/O pins for multiple interfaces and peripherals.
• Memory-intensive logic  Applications that need on-chip storage for buffering, packet handling, or LUT data benefit from the approximately 18.85 Mbits of embedded RAM.

Unique Advantages

• Substantial programmable logic: 298,000 logic elements provide the capacity to implement complex custom digital functions within a single device, reducing external component count.
• Integrated on-chip memory: Approximately 18.85 Mbits of RAM reduces the need for external memory in many buffering and temporary storage use cases.
• High I/O density: 281 I/O pins enable direct interfacing to sensors, peripherals, and other system components without extensive multiplexing.
• Compact BGA package: The 780-ball FCBGA (33×33) surface-mount package supports high-density PCB designs and conserves board area.
• Commercial temperature rating: Specified 0°C to 85°C operation aligns with standard commercial deployments.
• RoHS compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose EP2AGZ300FH29C4G?

The EP2AGZ300FH29C4G positions itself as a high-capacity, commercial-grade FPGA option for designers who need extensive programmable logic, significant embedded memory, and a large number of I/O in a compact surface-mount BGA package. Its voltage and temperature specifications, together with RoHS compliance, make it suitable for a wide range of commercial electronic applications.

Manufactured by Intel, the device offers an integrated platform that can reduce BOM complexity and consolidate multiple functions into a single programmable device, providing scalability and flexibility for evolving design requirements.

Request a quote or submit an inquiry to check availability and pricing for the EP2AGZ300FH29C4G for your next commercial FPGA design.