EP2AGZ300FH29I4N

The EP2AGZ300FH29I4N is an Intel Arria II GZ field programmable gate array (FPGA) supplied in a 780-ball BGA FCBGA package. It delivers a high density of programmable logic and embedded memory in a surface-mount package targeted at industrial applications.

Designed as part of the Arria II device family (which includes GX and GZ devices), this device combines a large logic element count with substantial on-chip RAM and extensive I/O to support complex, system-level FPGA implementations.

Key Features

• Core Logic  Approximately 298,000 logic elements, providing significant resource capacity for complex digital designs.
• Embedded Memory  Approximately 18.85 Mbits of on-chip RAM to support buffering, packet storage, and local data structures without external memory.
• I/O Density  281 I/O pins for flexible system interfacing and multiple peripheral connections.
• Power  Core voltage supply range specified at 870 mV to 930 mV to match platform power design and sequencing requirements.
• Thermal & Environmental  Industrial-grade operating range from −40 °C to 100 °C to meet demanding temperature environments.
• Packaging & Mounting  780-BBGA FCBGA package (supplier device package listed as 780-HBGA, 33×33) for surface-mount PCB assembly.
• Regulatory  RoHS compliant, supporting lead‑free manufacturing processes.
• Device Family Context  Part of the Arria II GZ family, referenced in the Arria II device handbook for electrical and switching characteristics across the series.

Unique Advantages

• High integration density: The approximately 298,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering BOM complexity.
• On-chip memory capacity: Nearly 19 Mbits of embedded RAM enable large buffers and data processing close to logic, minimizing external memory bandwidth requirements.
• Extensive I/O count: 281 I/O points allow flexible interfacing to peripherals, sensors, and high-pin-count mezzanine connectors without immediate external GPIO expanders.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in a wide range of industrial environments and thermal conditions.
• Surface-mount BGA packaging: The 780-ball BGA FCBGA (780-HBGA, 33×33) package is suited for automated assembly and dense PCB routing strategies.
• Low-voltage core operation: Narrow core supply range (870–930 mV) supports controlled power budgeting and consistent core performance.

Why Choose EP2AGZ300FH29I4N?

The EP2AGZ300FH29I4N offers a combination of high logic capacity, substantial embedded memory, and a broad I/O complement within an industrial-temperature, surface-mount BGA package. These characteristics make it suitable for designs that require dense programmable logic and on-chip buffering while meeting industrial environmental requirements.

Choosing this Arria II GZ device supports scalability across complex designs and benefits from the device-family documentation for electrical and switching characteristics, enabling informed integration and power/thermal planning.

Request a quote or submit an inquiry for pricing and availability to evaluate EP2AGZ300FH29I4N for your next design.