EP2AGZ300HF40C4G

IC FPGA 734 I/O 1517FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,555 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O734Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11920Number of Logic Elements/Cells298000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18854912

Overview of EP2AGZ300HF40C4G – Field Programmable Gate Array (FPGA) IC

The EP2AGZ300HF40C4G is an Intel Arria II family Field Programmable Gate Array (FPGA) IC optimized for commercial-grade embedded and interface applications. It combines a 40-nm low-power programmable logic engine with high I/O density and on-chip memory to support high-bandwidth system integration and protocol implementation.

Key Features

  • Core Architecture  40-nm Arria II device family architecture with a low-power programmable logic engine designed for ease of use and integration.
  • Logic Capacity  298,000 logic elements and 11,920 logic blocks provide substantial combinational and sequential resources for complex designs.
  • Embedded Memory  Approximately 18.85 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O and Transceivers  734 user I/O pins and family-level support for up to 24 full‑duplex CDR-based transceivers with serial rates up to 6.375 Gbps enable dense, high-speed connectivity and protocol support.
  • DSP and Math Resources  Family features include high-performance DSP blocks capable of supporting heavy signal processing tasks and configurable multiplier widths for flexible arithmetic implementations.
  • Power and Voltage  Core supply range of 0.870 V to 0.930 V with architecture-level power-optimization techniques for lower overall system power.
  • Package & Mounting  1517-FBGA (40 × 40) FCBGA package in a surface-mount form factor for board-level integration.
  • Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Security & Configuration  Family-level design security includes support for 256-bit AES programming file encryption and multiple configuration options.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High‑Bandwidth Networking  Implements interfacing and protocol logic for Ethernet and PCI Express systems using high I/O density and transceiver support.
  • Storage & Serial Interfaces  Supports SATA/SAS and other serial storage protocols with on-chip transceiver and SERDES capability.
  • Video and Broadcast Processing  Handles SD/HD/3G SDI and other serial digital interfaces with embedded memory and DSP resources for real‑time processing.
  • Wireless & Infrastructure  Suitable for front-end interface and transport protocols (for example CPRI, OBSAI) where deterministic I/O and transceiver performance are required.
  • DSP Acceleration  Offloads compute-intensive signal processing tasks using dedicated DSP blocks and on-chip memory.

Unique Advantages

  • High logic and memory density: Large logic element count and approximately 18.85 Mbits of embedded RAM reduce the need for external memory and simplify system architecture.
  • Broad interface support: High I/O count and family-level transceiver capability enable integration of multiple high-speed serial and parallel interfaces on a single device.
  • Power-efficient 40-nm engine: Low-voltage core operation and architecture-level power optimizations help lower system power consumption.
  • Commercial-grade reliability: Specified for 0 °C to 85 °C operation and supplied in a compact FCBGA package for robust board-level integration.
  • Design security and configuration options: Supported programming/encryption features guard intellectual property and support secure deployment.
  • Software and IP ecosystem: Arria II family integration with vendor IP and development tools simplifies implementation of common interfaces and accelerates time to market.

Why Choose EP2AGZ300HF40C4G?

The EP2AGZ300HF40C4G balances substantial logic capacity, on-chip memory, and high I/O density in a commercial-grade Arria II FPGA package, making it well suited for designs that require integrated high‑bandwidth interfaces and on‑device signal processing. Its 40-nm low-power architecture and configurable DSP features give teams flexibility to implement complex protocol stacks and acceleration blocks while managing board-level power and footprint.

Targeted at embedded systems, networking, video, storage, and DSP-accelerated applications, this device offers a platform-level feature set and vendor tooling to support scalable designs and long-term project needs.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for EP2AGZ300HF40C4G.

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