EP2AGZ300HF40C4N

The EP2AGZ300HF40C4N is an Intel Arria II GZ family field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers high logic density and extensive I/O capability in a commercial-grade device designed for complex, programmable digital designs.

With 298,000 logic elements, approximately 18.85 Mbits of embedded memory, and 734 available I/Os, this device targets designs that require significant on-chip resources and broad interfacing while operating within commercial temperature ranges and a low-voltage core supply.

Key Features

• High logic density — 298,000 logic elements to implement large-scale combinational and sequential logic structures.
• Embedded memory — Approximately 18.85 Mbits of on-chip RAM for buffering, state storage, and data handling.
• Rich I/O resources — 734 I/O pins to support extensive peripheral connectivity and multi-channel interfaces.
• Core supply — Low-voltage core operation with a specified supply range of 870 mV to 930 mV for the FPGA core.
• Package and mounting — 1517-BBGA (1517-FBGA, 40×40) FCBGA package, surface-mount mounting type for compact board-level integration.
• Commercial grade and temperature — Commercial-grade device rated for 0 °C to 85 °C operation.
• Standards compliance — RoHS compliant.
• Supported device family documentation — Part of the Arria II GZ device family and covered by the Arria II Device Handbook and device datasheet.

Typical Applications

• High-density programmable logic — Implement large custom logic blocks and complex finite-state machines using the device's 298,000 logic elements and embedded RAM.
• I/O-intensive systems — Leverage 734 I/Os for designs requiring extensive external interfacing or multi-channel connectivity.
• Commercial electronic equipment — Suited to commercial-temperature designs operating between 0 °C and 85 °C that demand significant on-chip resources.

Unique Advantages

• Substantial on-chip resources — Combines high logic element count and nearly 19 Mbits of embedded memory to reduce external component count and simplify system architecture.
• Extensive connectivity — 734 I/Os enable broad peripheral support and flexible board-level partitioning.
• Compact, board-ready package — 1517-BBGA FCBGA (1517-FBGA, 40×40) package supports high-density PCB layouts while providing a robust surface-mount solution.
• Low-voltage core operation — Core supply specified at 0.87–0.93 V supports modern power-optimized system designs.
• Commercial temperature rating — Designed for standard commercial environments with operation from 0 °C to 85 °C.
• Regulatory compliance — RoHS-compliant construction for environmentally conscious designs.

Why Choose EP2AGZ300HF40C4N?

The EP2AGZ300HF40C4N positions itself as a high-capacity Arria II GZ FPGA option for designers requiring a combination of large logic resources, significant embedded memory, and expansive I/O in a single commercial-grade device. Its low-voltage core supply and compact FCBGA package make it suitable for dense board designs where on-chip integration can reduce BOM and simplify system partitioning.

Backed by the Arria II device family documentation, this device is appropriate for development teams and procurement seeking a commercially rated FPGA with verifiable specifications for logic, memory, I/O, power, and temperature.

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