EP2AGZ300HF40I4G

The EP2AGZ300HF40I4G is a Field Programmable Gate Array (FPGA) IC manufactured by Intel, supplied in a 1517‑FBGA (40×40) surface‑mount package. This industrial‑grade device provides a high count of logic elements, substantial embedded RAM, and a large number of I/O pins for dense, programmable logic designs.

Designed for applications that require significant on‑chip logic and memory capacity at low core voltages and across an extended temperature range, the device delivers a combination of logic resources, I/O density, and package integration for demanding embedded and system designs.

Key Features

• Logic Capacity — 298,000 logic elements provide substantial programmable logic resources for complex designs and parallel processing architectures.
• Embedded Memory — Approximately 18.85 Mbits of on‑chip RAM to support buffers, FIFOs, and glue logic without external memory.
• I/O Density — Up to 734 I/O pins to support high‑pin‑count interfaces, parallel buses, and multi‑channel connectivity.
• Package & Mounting — 1517‑BBGA / FCBGA package in a 1517‑FBGA (40×40) footprint with surface‑mount mounting for compact board integration.
• Power Supply — Core voltage range specified at 0.870 V to 0.930 V for low‑voltage core operation.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implements custom control logic, motor control interfaces, and real‑time signal processing using large logic capacity and extended temperature operation.
• Communications & Networking — Supports high‑density I/O and on‑chip memory for packet buffering, protocol bridging, and interface aggregation.
• Data Acquisition & Processing — Provides embedded RAM and abundant logic elements for preprocessing, filtering, and aggregation of sensor or test data.
• High‑Density Interface Systems — Enables multi‑channel I/O implementations and board‑level integration where many external interfaces are required.

Unique Advantages

• High Logic Integration: 298,000 logic elements allow consolidation of multiple functions into a single device, reducing system BOM and board space.
• Substantial On‑Chip Memory: Approximately 18.85 Mbits of embedded RAM minimizes dependence on external memory for buffering and temporary storage.
• Extensive I/O Count: 734 I/O pins support dense external connectivity and multiple peripheral interfaces without additional I/O expanders.
• Industrial‑Grade Thermal Range: −40 °C to 100 °C operating range supports deployment in harsher environments and industrial equipment.
• Compact BGA Packaging: 1517‑FBGA (40×40) surface‑mount package balances pin density with board footprint for space‑constrained designs.
• Low‑Voltage Core Operation: 0.870–0.930 V supply range enables designs targeting low core power domains.

Why Choose EP2AGZ300HF40I4G?

The EP2AGZ300HF40I4G positions itself as a high‑capacity, industrial‑grade FPGA option for designs that demand large programmable logic fabric, significant on‑chip memory, and very high I/O density in a compact BGA package. Its combination of 298,000 logic elements, approximately 18.85 Mbits of embedded RAM, and 734 I/O pins provides the resource set needed to implement complex custom logic and multi‑interface systems.

With an industrial operating temperature range and RoHS compliance, the device is suitable for long‑life deployments in demanding environments where thermal range and regulatory compliance are required. The Intel manufacturing pedigree and the device's specification set make it appropriate for engineering teams building scalable, high‑integration embedded systems.

Request a quote or submit an inquiry to receive pricing and availability information for the EP2AGZ300HF40I4G.